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Part Details for APTMC120TAM12CTPAG by Microsemi Corporation
Results Overview of APTMC120TAM12CTPAG by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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APTMC120TAM12CTPAG Information
APTMC120TAM12CTPAG by Microsemi Corporation is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for APTMC120TAM12CTPAG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Transistors | 353 |
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RFQ |
Part Details for APTMC120TAM12CTPAG
APTMC120TAM12CTPAG CAD Models
APTMC120TAM12CTPAG Part Data Attributes
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APTMC120TAM12CTPAG
Microsemi Corporation
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Datasheet
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APTMC120TAM12CTPAG
Microsemi Corporation
Power Field-Effect Transistor
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | MODULE-26 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| Case Connection | ISOLATED | |
| Configuration | 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR | |
| DS Breakdown Voltage-Min | 1200 V | |
| Drain Current-Max (ID) | 220 A | |
| Drain-source On Resistance-Max | 0.012 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-XUFM-X26 | |
| Number of Elements | 6 | |
| Number of Terminals | 26 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation-Max (Abs) | 925 W | |
| Pulsed Drain Current-Max (IDM) | 440 A | |
| Surface Mount | NO | |
| Terminal Form | UNSPECIFIED | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON CARBIDE |
APTMC120TAM12CTPAG Frequently Asked Questions (FAQ)
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Microsemi recommends following the guidelines in the 'PCB Layout and Thermal Management' application note (document number 13034) for optimal performance and thermal management of the APTMC120TAM12CTPAG. This includes using a 4-layer PCB with a solid ground plane, placing thermal vias under the device, and using a heat sink or thermal interface material.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions and derating guidelines in the datasheet. Additionally, consider using a heat sink or thermal interface material, and ensure good airflow around the device. It's also recommended to perform thermal simulations and testing to validate the design.
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Microsemi recommends following the guidelines in the 'Soldering and Assembly' application note (document number 13035) for the APTMC120TAM12CTPAG. This includes using a soldering iron with a temperature range of 250°C to 260°C, and following the recommended soldering profile and assembly procedures.
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To troubleshoot and debug issues with the APTMC120TAM12CTPAG, start by reviewing the datasheet and application notes for common pitfalls and mistakes. Use oscilloscopes and logic analyzers to monitor the device's signals and behavior. Microsemi also provides a range of development tools and evaluation boards that can help with debugging and troubleshooting.
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The APTMC120TAM12CTPAG is designed to meet the radiation hardness and reliability requirements of aerospace and defense applications. It's built with radiation-hardened components and has undergone testing to ensure compliance with industry standards such as MIL-STD-883 and MIL-STD-202. For specific details, contact Microsemi's radiation hardness assurance team.