Part Details for APA150-FGG144IX95 by Microchip Technology Inc
Results Overview of APA150-FGG144IX95 by Microchip Technology Inc
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Applications
Energy and Power Systems
Renewable Energy
Automotive
APA150-FGG144IX95 Information
APA150-FGG144IX95 by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for APA150-FGG144IX95
APA150-FGG144IX95 CAD Models
APA150-FGG144IX95 Part Data Attributes
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APA150-FGG144IX95
Microchip Technology Inc
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APA150-FGG144IX95
Microchip Technology Inc
Field Programmable Gate Array, CMOS, PBGA144
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | 1 MM PITCH, ROHS COMPLIANT, FBGA-144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B144 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Equivalent Gates | 150000 | |
| Number of Inputs | 100 | |
| Number of Outputs | 100 | |
| Number of Terminals | 144 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 6144 CLBS, 150000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA144,12X12,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 13 mm |