Part Details for AP-MSD08GIA-1FTM by Apacer Technology Inc
Results Overview of AP-MSD08GIA-1FTM by Apacer Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
AP-MSD08GIA-1FTM Information
AP-MSD08GIA-1FTM by Apacer Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for AP-MSD08GIA-1FTM
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
AP-MSD08GIA-1FTM-ND
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DigiKey | MEM CARD MICROSDHC 8GB CLS10 MLC Lead time: 8 Weeks Container: Box | Limited Supply - Call |
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Buy Now |
Part Details for AP-MSD08GIA-1FTM
AP-MSD08GIA-1FTM CAD Models
AP-MSD08GIA-1FTM Part Data Attributes
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AP-MSD08GIA-1FTM
Apacer Technology Inc
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Datasheet
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AP-MSD08GIA-1FTM
Apacer Technology Inc
Flash Card, 8GX8, CARD-8
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | APACER TECHNOLOGY INC | |
| Package Description | DIE, | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 50 MHz | |
| JESD-30 Code | R-XUUC-N8 | |
| Length | 15 mm | |
| Memory Density | 68719476736 bit | |
| Memory IC Type | FLASH CARD | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 8589934592 words | |
| Number of Words Code | 8000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8GX8 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 2.7 V | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | MLC NAND TYPE | |
| Width | 11 mm |
AP-MSD08GIA-1FTM Frequently Asked Questions (FAQ)
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The operating temperature range for AP-MSD08GIA-1FTM is -40°C to 85°C, as specified in the datasheet. However, it's recommended to operate within 0°C to 70°C for optimal performance and reliability.
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To ensure data integrity, it's recommended to implement a power-fail interrupt (PFI) or a voltage detector to detect power failures. This allows the system to take necessary actions to prevent data corruption. Additionally, consider using a capacitor or a battery backup to provide a temporary power source during power failures.
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The recommended storage condition for AP-MSD08GIA-1FTM is in a dry, cool place with a temperature range of -40°C to 30°C and relative humidity below 80%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
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While AP-MSD08GIA-1FTM is designed to withstand some level of vibration, it's essential to consult the datasheet and Apacer's application notes for specific vibration tolerance. In general, it's recommended to follow the IEC 60068-2-6 standard for vibration testing. If your application exceeds these specifications, consider using additional mechanical protection or vibration dampening measures.
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To prevent electrostatic discharge (ESD) damage, follow standard ESD handling procedures, such as using an ESD wrist strap, ESD mat, or ESD bag. Ensure that all personnel handling the device are properly grounded, and avoid touching the device's pins or components.