Part Details for AM3354BZCE60R by Texas Instruments
Results Overview of AM3354BZCE60R by Texas Instruments
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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AM3354BZCE60R Information
AM3354BZCE60R by Texas Instruments is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for AM3354BZCE60R
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
296-AM3354BZCE60RTR-ND
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DigiKey | SITARA PROCESSOR: ARM CORTEX-A8 Min Qty: 1000 Lead time: 18 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$7.7829 | Buy Now |
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DISTI #
595-AM3354BZCE60R
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Mouser Electronics | Microprocessors - MPU Sitara processor: Ar m Cortex-A8 3D grap RoHS: Compliant | 1000 |
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$7.4400 / $14.6600 | Buy Now |
Part Details for AM3354BZCE60R
AM3354BZCE60R CAD Models
AM3354BZCE60R Part Data Attributes
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AM3354BZCE60R
Texas Instruments
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Datasheet
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AM3354BZCE60R
Texas Instruments
Sitara processor: Arm Cortex-A8, 3D graphics, CAN 298-NFBGA 0 to 90
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 26 MHz | |
| External Data Bus Width | 16 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B298 | |
| Length | 13 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 64 | |
| Number of External Interrupts | 1 | |
| Number of Serial I/Os | 6 | |
| Number of Terminals | 298 | |
| On Chip Data RAM Width | 8 | |
| Operating Temperature-Max | 90 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA298,19X19,25 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (words) | 65536 | |
| Seated Height-Max | 1.3 mm | |
| Speed | 600 MHz | |
| Supply Current-Max | 400 mA | |
| Supply Voltage-Max | 1.144 V | |
| Supply Voltage-Min | 1.056 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |