Part Details for ADSP-SC587BBCZ-5B by Analog Devices Inc
Results Overview of ADSP-SC587BBCZ-5B by Analog Devices Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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ADSP-SC587BBCZ-5B Information
ADSP-SC587BBCZ-5B by Analog Devices Inc is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for ADSP-SC587BBCZ-5B
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
505-ADSP-SC587BBCZ-5B-ND
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DigiKey | ARM, 2XSHARC, DUAL DDR, HPC PACK Min Qty: 1 Lead time: 10 Weeks Container: Tray |
11 In Stock |
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$57.2839 / $75.8700 | Buy Now |
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DISTI #
584-SPSC587BBCZ5B
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC ARM, 2xSHARC, dual DDR, HPC package RoHS: Compliant | 11 |
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$55.0800 / $74.9000 | Buy Now |
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Analog Devices Inc | ARM, 2xSHARC, dual DDR, HPC pa Package Multiple: 1 | 239 |
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$42.9700 / $75.8700 | Buy Now |
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DISTI #
35216580
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Verical | DSP Fixed-Point/Floating-Point 32bit 500MHz 800MIPS 529-Pin CSP-BGA Tray RoHS: Compliant Min Qty: 11 Package Multiple: 11 | Americas - 231 |
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$54.5084 | Buy Now |
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DISTI #
ADSPSC587BBCZ5B
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Richardson RFPD | DIGITAL SIGNAL PROCESSOR IC RoHS: Compliant Min Qty: 11 | 0 |
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$57.6300 / $64.2200 | Buy Now |
Part Details for ADSP-SC587BBCZ-5B
ADSP-SC587BBCZ-5B CAD Models
ADSP-SC587BBCZ-5B Part Data Attributes
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ADSP-SC587BBCZ-5B
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
ADSP-SC587BBCZ-5B
Analog Devices Inc
Dual-core SHARC+ and ARM Cortex-A5 SOC, dual DDR, 2xEthernet, 2xUSB, SDIO, 529-cspBGA
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | CSPBGA-349 | |
| Pin Count | 529 | |
| Manufacturer Package Code | BC-529-1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Date Of Intro | 2017-09-26 | |
| Samacsys Manufacturer | Analog Devices | |
| Bus Compatibility | SPI; UART | |
| Clock Frequency-Max | 500 MHz | |
| JESD-30 Code | S-PBGA-B349 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 349 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA529,23X23,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.15 V | |
| Supply Voltage-Min | 1.05 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
ADSP-SC587BBCZ-5B Frequently Asked Questions (FAQ)
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The recommended power-up sequence is to apply power to the core voltage (VDDINT) first, followed by the I/O voltage (VDDIO). This ensures that the internal voltage regulators are powered up correctly.
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To optimize performance, consider the following: (1) use the highest possible clock frequency, (2) optimize memory access patterns, (3) use the cache effectively, and (4) minimize the number of context switches. Additionally, use the ADSP-SC587BBCZ-5B's built-in performance counters to identify bottlenecks.
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The ADSP-SC587BBCZ-5B has a maximum junction temperature of 125°C. Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the package. Also, consider using thermal interface materials to improve heat transfer.
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To ensure EMC, follow these guidelines: (1) use a shielded enclosure, (2) keep signal lines short and away from noise sources, (3) use decoupling capacitors, (4) avoid running signal lines near the device's clock lines, and (5) follow the recommended PCB layout guidelines.
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In harsh environments, consider the following: (1) temperature range, (2) humidity, (3) vibration, and (4) radiation. Ensure the device is properly packaged and sealed, and consider using conformal coatings or potting compounds to protect the device.