-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Super Sequencer® with Margining Control and Temperature Monitoring
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
ADM1062ACPZ-REEL7 by Analog Devices Inc is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
ADM1062ACPZ-REEL7CT-ND
|
DigiKey | IC SUPERVISOR 10 CHANNEL 40LFCSP Min Qty: 1 Lead time: 10 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
1303 In Stock |
|
$15.0625 / $24.7000 | Buy Now |
DISTI #
584-ADM1062ACPZ-R7
|
Mouser Electronics | Supervisory Circuits Super Sequencer with Margining Control and Temperature Monitoring RoHS: Compliant | 61 |
|
$15.0600 / $23.3500 | Buy Now |
DISTI #
V72:2272_06219954
|
Arrow Electronics | Processor Supervisor 10 Open Collector/Push-Pull 40-Pin LFCSP EP T/R RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 13 Weeks Date Code: 2323 Container: Cut Strips | Americas - 30 |
|
$15.4500 / $15.9800 | Buy Now |
|
Analog Devices Inc | Programmable Supervisor Sequen Min Qty: 1 Package Multiple: 750 | 261 |
|
$12.0500 / $24.7000 | Buy Now |
|
Quest Components | 8 |
|
$16.8608 / $18.9684 | Buy Now | |
|
Vyrian | Other Function Semiconductors | 12 |
|
RFQ |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
ADM1062ACPZ-REEL7
Analog Devices Inc
Buy Now
Datasheet
|
Compare Parts:
ADM1062ACPZ-REEL7
Analog Devices Inc
Super Sequencer® with Margining Control and Temperature Monitoring
|
Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Part Package Code | QFN | |
Package Description | LFCSP-40 | |
Pin Count | 40 | |
Manufacturer Package Code | CP-40-9 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Analog Devices | |
Adjustable Threshold | YES | |
Analog IC - Other Type | POWER SUPPLY SUPPORT CIRCUIT | |
JESD-30 Code | S-XQCC-N40 | |
JESD-609 Code | e3 | |
Length | 6 mm | |
Moisture Sensitivity Level | 3 | |
Number of Channels | 10 | |
Number of Functions | 1 | |
Number of Terminals | 40 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC40,.24SQ,20 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1 mm | |
Supply Current-Max (Isup) | 6 mA | |
Supply Voltage-Nom (Vsup) | 2.7 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 6 mm |
This table gives cross-reference parts and alternative options found for ADM1062ACPZ-REEL7. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ADM1062ACPZ-REEL7, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
ADM1062ACPZ | Analog Devices Inc | Check for Price | Super Sequencer® with Margining Control and Temperature Monitoring | ADM1062ACPZ-REEL7 vs ADM1062ACPZ |
A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device's thermal pad should be connected to the ground plane using multiple thermal vias.
Ensure that the device is operated within the recommended operating conditions, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material between the device and the heat sink.
Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device operates within the recommended temperature range.
Check the power supply voltage, ensure that the POR pin is properly connected, and verify that the reset signal is properly generated. Also, review the system's power-up sequence to ensure that the device is properly initialized.
Ensure that the power supply provides a stable voltage within the recommended range, and that it can supply the required current. Also, consider using a low-dropout regulator (LDO) to minimize voltage drops and ensure reliable operation.