Part Details for A2I25D025NR1 by NXP Semiconductors
Results Overview of A2I25D025NR1 by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
A2I25D025NR1 Information
A2I25D025NR1 by NXP Semiconductors is an RF Power Field-Effect Transistor.
RF Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for A2I25D025NR1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK8092
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Newark | Airfast Rf Power Ldmos Transistor, 2300-2690 Mhz, 2.5 W Avg., 28 V/ Reel Rohs Compliant: Yes |Nxp A2I25D025NR1 RoHS: Compliant Min Qty: 500 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$21.0200 | Buy Now |
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Rochester Electronics | Airfast RF Power LDMOS Transistor, 2300-2690 MHz, 2.5 W Avg., 28 V RoHS: Compliant Status: Obsolete Min Qty: 1 | 4197 |
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$16.2300 / $20.2900 | Buy Now |
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DISTI #
A2I25D025NR1
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Avnet Silica | Transistor RF FET 65V 2100MHz to 2900MHz 18Pin TO270 TR (Alt: A2I25D025NR1) RoHS: Compliant Min Qty: 500 Package Multiple: 500 | Silica - 0 |
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Buy Now | |
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Cytech Systems Limited | RF MOSFET LDMOS 28V TO270-17 | 500 |
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RFQ | |
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DISTI #
A2I25D025NR1
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EBV Elektronik | Transistor RF FET 65V 2100MHz to 2900MHz 18Pin TO270 TR (Alt: A2I25D025NR1) RoHS: Compliant Min Qty: 500 Package Multiple: 500 | EBV - 0 |
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Buy Now | |
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Vyrian | Transistors | 676 |
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RFQ |
Part Details for A2I25D025NR1
A2I25D025NR1 CAD Models
A2I25D025NR1 Part Data Attributes
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A2I25D025NR1
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
A2I25D025NR1
NXP Semiconductors
RF POWER, FET
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | NXP | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Finish | Tin (Sn) | |
| Time@Peak Reflow Temperature-Max (s) | 40 |
Alternate Parts for A2I25D025NR1
This table gives cross-reference parts and alternative options found for A2I25D025NR1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of A2I25D025NR1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MW7IC2425GNR1 | NXP Semiconductors | Check for Price | S BAND, Si, N-CHANNEL, RF POWER, MOSFET | A2I25D025NR1 vs MW7IC2425GNR1 |
A2I25D025NR1 Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. NXP provides a recommended PCB layout in their application note AN11542.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and consider using a heat sink or thermal management system. Additionally, ensure that the device is operated within its specified temperature range.
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NXP recommends following the JEDEC J-STD-020D.1 standard for soldering conditions. The recommended peak temperature is 260°C, with a maximum time above 217°C of 60 seconds. It's essential to follow these guidelines to prevent damage to the device.
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To prevent ESD damage, handle the devices in an ESD-protected environment, use ESD-protective packaging, and follow proper handling and assembly procedures. NXP also recommends using ESD protection devices, such as diodes or resistors, in the circuit design.
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The A2I25D025NR1 has an MSL rating of 3, which means it's sensitive to moisture. To prevent damage, it's essential to follow proper storage and handling procedures, and to bake the devices according to NXP's recommendations before reflow soldering.