Part Details for 9FGV0431AKLF by Integrated Device Technology Inc
Results Overview of 9FGV0431AKLF by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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9FGV0431AKLF Information
9FGV0431AKLF by Integrated Device Technology Inc is a Clock Generator.
Clock Generators are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for 9FGV0431AKLF
9FGV0431AKLF CAD Models
9FGV0431AKLF Part Data Attributes
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9FGV0431AKLF
Integrated Device Technology Inc
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Datasheet
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9FGV0431AKLF
Integrated Device Technology Inc
VFQFPN-32, Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | VFQFPN | |
| Package Description | MLF-32 | |
| Pin Count | 32 | |
| Manufacturer Package Code | NLG32P1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-XQCC-N32 | |
| JESD-609 Code | e3 | |
| Length | 5 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Output Clock Frequency-Max | 25 MHz | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC32,.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Primary Clock/Crystal Frequency-Nom | 27 MHz | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Current-Max | 30 mA | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 5 mm | |
| uPs/uCs/Peripheral ICs Type | CLOCK GENERATOR, PROCESSOR SPECIFIC |
Alternate Parts for 9FGV0431AKLF
This table gives cross-reference parts and alternative options found for 9FGV0431AKLF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 9FGV0431AKLF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 9FGV0441AKILFT | Integrated Device Technology Inc | $1.7274 | VFQFPN-32, Reel | 9FGV0431AKLF vs 9FGV0441AKILFT |
| 9FGV0441AKLF | Integrated Device Technology Inc | $1.8479 | VFQFPN-32, Tray | 9FGV0431AKLF vs 9FGV0441AKLF |
| 9FGV0441AKILF | Renesas Electronics Corporation | $2.2429 | 4-output 1.8V PCIe Gen1-4 Clock Generator with Zo = 100 ohms, VFQFPN490/Tray | 9FGV0431AKLF vs 9FGV0441AKILF |
| 9FGV0431AKILFT | Integrated Device Technology Inc | Check for Price | VFQFPN-32, Reel | 9FGV0431AKLF vs 9FGV0431AKILFT |
| 9FGV0431AKLF | Renesas Electronics Corporation | Check for Price | 4-output 1.8V PCIe Gen1-4 Clock Generator, VFQFPN490/Tray | 9FGV0431AKLF vs 9FGV0431AKLF |
9FGV0431AKLF Frequently Asked Questions (FAQ)
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For optimal performance, it's recommended to follow a 4-layer PCB stackup with a solid ground plane, and to use thermal vias to dissipate heat from the device. A minimum of 2oz copper thickness is recommended for the top and bottom layers.
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To ensure signal integrity and minimize jitter, use a differential signal pair with a 100-ohm differential impedance, and maintain a consistent signal trace length and impedance throughout the PCB. Additionally, use a clock signal with a high-quality, low-jitter source, and consider using a clock jitter attenuator if necessary.
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The device requires a specific power sequencing and reset protocol to ensure proper operation. The recommended power-up sequence is VCC, then VCCP, followed by a 10ms delay before asserting the reset signal. The reset signal should be held low for at least 10ms to ensure a clean reset.
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To optimize power consumption, use the device's power-down modes, such as the sleep mode, when not in use. Additionally, optimize the clock frequency and voltage supply to the minimum required for the application. Consider using a power management IC to regulate the voltage supply and reduce power dissipation.
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The device is sensitive to electrostatic discharge (ESD). To prevent damage, handle the device with an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD diodes and resistors. Follow proper handling and storage procedures to prevent ESD damage.