Part Details for 9DB104BFLFT by Integrated Device Technology Inc
Results Overview of 9DB104BFLFT by Integrated Device Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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9DB104BFLFT Information
9DB104BFLFT by Integrated Device Technology Inc is a Clock Driver.
Clock Drivers are under the broader part category of Logic Components.
Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.
Price & Stock for 9DB104BFLFT
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 906 |
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RFQ |
Part Details for 9DB104BFLFT
9DB104BFLFT CAD Models
9DB104BFLFT Part Data Attributes
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9DB104BFLFT
Integrated Device Technology Inc
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Datasheet
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9DB104BFLFT
Integrated Device Technology Inc
SSOP-28, Reel
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | SSOP | |
Package Description | 0.209 INCH, ROHS COMPLIANT, MO-150, SSOP-28 | |
Pin Count | 28 | |
Manufacturer Package Code | PYG28 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Family | 9DB | |
Input Conditioning | DIFFERENTIAL | |
JESD-30 Code | R-PDSO-G28 | |
JESD-609 Code | e3 | |
Length | 10.2 mm | |
Logic IC Type | PLL BASED CLOCK DRIVER | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Inverted Outputs | ||
Number of Terminals | 28 | |
Number of True Outputs | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SSOP | |
Package Equivalence Code | SSOP28,.3 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Same Edge Skew-Max (tskwd) | 0.05 ns | |
Seated Height-Max | 2 mm | |
Supply Voltage-Max (Vsup) | 3.465 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 5.3 mm |
9DB104BFLFT Frequently Asked Questions (FAQ)
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A good PCB layout for the 9DB104BFLFT should consider signal integrity, power integrity, and thermal management. It's recommended to follow the guidelines provided in the IDT application note AN-875, which includes layout recommendations for clock distribution, power supply, and signal routing.
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The 9DB104BFLFT requires a 1.8V core voltage and a 3.3V I/O voltage. It's essential to follow the power sequencing requirements outlined in the datasheet, which involves powering up the 3.3V I/O voltage before the 1.8V core voltage. Additionally, ensure that the power supply noise is within the specified limits to prevent device malfunction.
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The 9DB104BFLFT has a maximum junction temperature of 125°C. To ensure reliable operation, it's crucial to implement proper thermal management, such as using a heat sink, thermal vias, and thermal pads. The device's thermal resistance (θJA) is 24°C/W, and the thermal resistance (θJC) is 10°C/W.
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The 9DB104BFLFT can be configured for different clock frequencies using the clock control registers. The device supports various clocking options, including internal clock generation, external clock input, and spread spectrum clocking. Refer to the datasheet and application notes for specific configuration details.
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The 9DB104BFLFT is a high-frequency device that can generate electromagnetic interference (EMI) and radio-frequency interference (RFI). To minimize EMI and RFI, it's essential to follow proper PCB design practices, such as using shielding, grounding, and decoupling techniques. Additionally, ensure that the device is operated within the specified frequency range and power levels.