Part Details for 83PR226BKI-01LF by Integrated Device Technology Inc
Results Overview of 83PR226BKI-01LF by Integrated Device Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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83PR226BKI-01LF Information
83PR226BKI-01LF by Integrated Device Technology Inc is a Clock Generator.
Clock Generators are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 10106124-F006001LF | Amphenol Communications Solutions | PwrBlade+® Connector, Power Connectors, 15HP+24S STB, Right Angle, Header. | |
| 10106266-0009001LF | Amphenol Communications Solutions | PwrBlade+® , Power Connectors, 36S, Vertical, Header. | |
| 66506-001LF | Amphenol Communications Solutions | Quickie Header, Wire to Board Connector, 4 wall, Double Row, 10 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating. |
Price & Stock for 83PR226BKI-01LF
| Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock, ship today | 15000 |
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RFQ |
Part Details for 83PR226BKI-01LF
83PR226BKI-01LF CAD Models
83PR226BKI-01LF Part Data Attributes
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83PR226BKI-01LF
Integrated Device Technology Inc
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Datasheet
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83PR226BKI-01LF
Integrated Device Technology Inc
VFQFPN-10, Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | VFQFPN | |
| Package Description | VQFN-10 | |
| Pin Count | 10 | |
| Manufacturer Package Code | NRG10 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | ALSO OPERATES AT 3.3V SUPPLY | |
| JESD-30 Code | R-XBCC-N10 | |
| JESD-609 Code | e3 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 10 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Clock Frequency-Max | 213.33 MHz | |
| Package Body Material | UNSPECIFIED | |
| Package Code | VBCC | |
| Package Equivalence Code | LCC10,.2X.27,100/40 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Primary Clock/Crystal Frequency-Nom | 25 MHz | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Current-Max | 172 mA | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 5 mm | |
| uPs/uCs/Peripheral ICs Type | CLOCK GENERATOR, OTHER |
83PR226BKI-01LF Frequently Asked Questions (FAQ)
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A good PCB layout for the 83PR226BKI-01LF involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
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To ensure proper powering and decoupling, use a high-quality power supply with low ripple and noise. Add decoupling capacitors (e.g., 10uF and 100nF) close to the device, and consider adding a 1uF capacitor between the VCC and GND pins. Ensure the power supply can provide the required current.
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The 83PR226BKI-01LF has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device will be operating in high-temperature environments. Monitor the device's thermal performance and adjust the system design accordingly.
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To troubleshoot issues, start by verifying the power supply and decoupling. Check for proper signal integrity, and ensure the device is properly configured. Use oscilloscopes and logic analyzers to debug the signals. Consult the datasheet and application notes for specific troubleshooting guidelines.
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Yes, the 83PR226BKI-01LF is a high-frequency device and requires proper EMI/EMC design considerations. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference. Ensure the PCB layout and component placement minimize radiation and susceptibility.