Part Details for 82P2282PFG by Integrated Device Technology Inc
Results Overview of 82P2282PFG by Integrated Device Technology Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
82P2282PFG Information
82P2282PFG by Integrated Device Technology Inc is a Digital Transmission Interface.
Digital Transmission Interfaces are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for 82P2282PFG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 159 |
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RFQ | ||
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ComSIT USA | Electronic Component RoHS: Compliant |
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RFQ | |
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DISTI #
82P2282PFG
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IBS Electronics | 82P2282PFG by INTEGRATED DEVICE TECHNOLOGY is a dual-channel transceiver designed for high-speed data communication, offering reliable performance and efficient data transfer capabilities. Min Qty: 15 Package Multiple: 1 | 0 |
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$40.3390 / $41.2490 | Buy Now |
Part Details for 82P2282PFG
82P2282PFG CAD Models
82P2282PFG Part Data Attributes
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82P2282PFG
Integrated Device Technology Inc
Buy Now
Datasheet
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Compare Parts:
82P2282PFG
Integrated Device Technology Inc
TQFP-100, Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | TQFP | |
| Package Description | GREEN, TQFP-100 | |
| Pin Count | 100 | |
| Manufacturer Package Code | PKG100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Carrier Type | T-1(DS1) | |
| Carrier Type (2) | T-1(DS1) | |
| JESD-30 Code | R-PQFP-G100 | |
| JESD-609 Code | e3 | |
| Length | 20 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LQFP | |
| Package Equivalence Code | QFP100,.63X.87 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Telecom IC Type | PCM TRANSCEIVER | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 mm |
Alternate Parts for 82P2282PFG
This table gives cross-reference parts and alternative options found for 82P2282PFG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 82P2282PFG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 82P2282PFG | Renesas Electronics Corporation | Check for Price | 2 Channel T1 / J1 / E1 Transceiver, TQFP72/Tray | 82P2282PFG vs 82P2282PFG |
82P2282PFG Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power planes to minimize noise and crosstalk.
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Ensure good thermal conductivity by using a heat sink or thermal pad, and follow the recommended operating temperature range of -40°C to 85°C. Also, consider using a thermal interface material to improve heat transfer.
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Use shielding, filtering, and grounding techniques to minimize EMI and RFI. Keep the device away from high-frequency sources, and use a metal shield or Faraday cage to enclose the device.
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Use a logic analyzer or oscilloscope to monitor the device's signals. Check the power supply voltage, clock frequency, and data transmission rates. Consult the datasheet and application notes for troubleshooting guidelines.
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Power up the device in the following sequence: VCC, then VCCIO, and finally the clock signal. Ensure that the power supply voltage is stable and within the recommended range before applying the clock signal.