Part Details for 82P2281PFG by Integrated Device Technology Inc
Results Overview of 82P2281PFG by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
82P2281PFG Information
82P2281PFG by Integrated Device Technology Inc is a Digital Transmission Interface.
Digital Transmission Interfaces are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part Details for 82P2281PFG
82P2281PFG CAD Models
82P2281PFG Part Data Attributes
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82P2281PFG
Integrated Device Technology Inc
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Datasheet
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82P2281PFG
Integrated Device Technology Inc
TQFP-80, Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | TQFP | |
| Package Description | GREEN, TQFP-80 | |
| Pin Count | 80 | |
| Manufacturer Package Code | PNG80 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Carrier Type | T-1(DS1) | |
| Carrier Type (2) | T-1(DS1) | |
| JESD-30 Code | S-PQFP-G80 | |
| JESD-609 Code | e3 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 80 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LQFP | |
| Package Equivalence Code | QFP80,.64SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Telecom IC Type | PCM TRANSCEIVER | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 mm |
Alternate Parts for 82P2281PFG
This table gives cross-reference parts and alternative options found for 82P2281PFG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 82P2281PFG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| 82P2281PFG8 | Renesas Electronics Corporation | Check for Price | PCM Transceiver, 1-Func, T-1(DS1), Bipolar, PQFP80 | 82P2281PFG vs 82P2281PFG8 |
| 82P2281PF | Integrated Device Technology Inc | Check for Price | PCM Transceiver, 1-Func, T-1(DS1), Bipolar, PQFP80, TQFP-80 | 82P2281PFG vs 82P2281PF |
| 82P2281PF8 | Integrated Device Technology Inc | Check for Price | PCM Transceiver, 1-Func, T-1(DS1), Bipolar, PQFP80, TQFP-80 | 82P2281PFG vs 82P2281PF8 |
| IDT82P2281PN | Integrated Device Technology Inc | Check for Price | PCM Transceiver, 1-Func, CEPT PCM-30/E-1, PQFP80, TQFP-80 | 82P2281PFG vs IDT82P2281PN |
82P2281PFG Frequently Asked Questions (FAQ)
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A good PCB layout for the 82P2281PFG involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
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To ensure reliable operation of the 82P2281PFG in high-temperature environments, it is recommended to follow proper thermal design guidelines, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
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When using the 82P2281PFG in a system with multiple power domains, it is essential to ensure that the device is properly powered down when not in use to prevent power domain conflicts. Additionally, proper isolation and level-shifting may be required to ensure signal integrity between domains.
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To troubleshoot issues with the 82P2281PFG, start by verifying the power supply and clock signals, then check the input and output signals using an oscilloscope or logic analyzer. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
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To minimize EMI and RFI issues with the 82P2281PFG, use proper shielding, grounding, and filtering techniques. Ensure that the device is placed in a shielded enclosure, and use EMI filters or common-mode chokes to reduce emissions.