Part Details for 821034DNG by Integrated Device Technology Inc
Results Overview of 821034DNG by Integrated Device Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
821034DNG Information
821034DNG by Integrated Device Technology Inc is a Codec.
Codecs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for 821034DNG
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Telecommunications | 58 |
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RFQ | |
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Win Source Electronics | IC PCM CODEC QUAD MPI 52QFP | 1340 |
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$19.8115 / $29.7171 | Buy Now |
Part Details for 821034DNG
821034DNG CAD Models
821034DNG Part Data Attributes
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821034DNG
Integrated Device Technology Inc
Buy Now
Datasheet
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Compare Parts:
821034DNG
Integrated Device Technology Inc
PQFP-52, Tray
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | PQFP | |
Package Description | QFP-100 | |
Pin Count | 52 | |
Manufacturer Package Code | DNG52 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Companding Law | A/MU-LAW | |
Filter | YES | |
JESD-30 Code | S-PQFP-G52 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 52 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Telecom IC Type | PCM CODEC | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN | |
Terminal Form | GULL WING | |
Terminal Position | QUAD |
Alternate Parts for 821034DNG
This table gives cross-reference parts and alternative options found for 821034DNG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 821034DNG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
821034DNG | Renesas Electronics Corporation | Check for Price | 4 Channel PCM CODEC, MPI Interface, 5.0V, PQFP84/Tray | 821034DNG vs 821034DNG |
821034DNG Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
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Use a thermal management strategy such as heat sinks, thermal interfaces, or thermal vias to keep the junction temperature below 125°C. Ensure proper airflow and avoid thermal hotspots.
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Operating at a lower voltage may reduce power consumption but may also affect performance and reliability. Operating at a higher voltage may improve performance but increases power consumption and reduces reliability.
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Use ESD protection devices such as TVS diodes or ESD arrays on the input/output lines. Ensure that the ESD protection devices are rated for the maximum voltage and current of the application.
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Ensure that the power supply voltage ramps up and down slowly (typically 1-10 ms) to prevent damage to the device. Power sequencing should be controlled to prevent voltage differences between power domains.