Part Details for 72T36135ML6BB by Integrated Device Technology Inc
Results Overview of 72T36135ML6BB by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
72T36135ML6BB Information
72T36135ML6BB by Integrated Device Technology Inc is an FIFO.
FIFOs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for 72T36135ML6BB
72T36135ML6BB CAD Models
72T36135ML6BB Part Data Attributes
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72T36135ML6BB
Integrated Device Technology Inc
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Datasheet
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72T36135ML6BB
Integrated Device Technology Inc
PBGA-240, Tray
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | PBGA | |
| Package Description | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 | |
| Pin Count | 240 | |
| Manufacturer Package Code | BB240 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 3.8 ns | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| Cycle Time | 6 ns | |
| JESD-30 Code | S-PBGA-B240 | |
| JESD-609 Code | e0 | |
| Length | 19 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | OTHER FIFO | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 240 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX36 | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA240,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.76 mm | |
| Standby Current-Max | 0.14 A | |
| Supply Current-Max | 0.18 mA | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 mm |
Alternate Parts for 72T36135ML6BB
This table gives cross-reference parts and alternative options found for 72T36135ML6BB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 72T36135ML6BB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| IDT72T36135ML6BBGI | Integrated Device Technology Inc | Check for Price | FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240 | 72T36135ML6BB vs IDT72T36135ML6BBGI |
| IDT72T36135ML6BBG | Integrated Device Technology Inc | Check for Price | FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240 | 72T36135ML6BB vs IDT72T36135ML6BBG |
| 72T36135ML6BBGI | Integrated Device Technology Inc | Check for Price | FIFO, 512KX36, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240 | 72T36135ML6BB vs 72T36135ML6BBGI |
| 72T36135ML6BBI | Integrated Device Technology Inc | Check for Price | PBGA-240, Tray | 72T36135ML6BB vs 72T36135ML6BBI |
| 72T36135ML6BBI | Renesas Electronics Corporation | Check for Price | 512K x 36 TeraSync FIFO, 2.5V, PBGA84/Tray | 72T36135ML6BB vs 72T36135ML6BBI |
| 72T36135ML6BB | Renesas Electronics Corporation | Check for Price | 512K x 36 TeraSync FIFO, 2.5V, PBGA84/Tray | 72T36135ML6BB vs 72T36135ML6BB |
| 72T36135ML5BB | Renesas Electronics Corporation | Check for Price | 512K x 36 TeraSync FIFO, 2.5V, PBGA84/Tray | 72T36135ML6BB vs 72T36135ML5BB |
| 72T36135ML5BB | Integrated Device Technology Inc | Check for Price | PBGA-240, Tray | 72T36135ML6BB vs 72T36135ML5BB |
| IDT72T36135ML5BBG | Integrated Device Technology Inc | Check for Price | FIFO, 512KX36, 3.6ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240 | 72T36135ML6BB vs IDT72T36135ML5BBG |
| IDT72T36135ML5BB | Renesas Electronics Corporation | Check for Price | FIFO, 512KX36, 3.6ns, Synchronous/Asynchronous, CMOS, PBGA240 | 72T36135ML6BB vs IDT72T36135ML5BB |
72T36135ML6BB Frequently Asked Questions (FAQ)
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A good PCB layout for the 72T36135ML6BB should consider signal integrity, power integrity, and thermal management. It's recommended to follow the guidelines provided in the IDT application note AN-803, which includes layout recommendations for signal traces, power planes, and decoupling capacitors.
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To ensure reliable operation across the entire operating temperature range, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature. It's also recommended to perform thorough testing and validation at the extremes of the operating temperature range.
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Using a different clock frequency than the recommended 100 MHz may affect the device's performance, power consumption, and signal integrity. It's essential to consult the datasheet and application notes to understand the impact of clock frequency on the device's behavior and to ensure that the system design can accommodate any changes. IDT provides guidance on clock frequency selection and trade-offs in the application note AN-802.
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To troubleshoot issues related to signal integrity and jitter, it's recommended to use high-speed signal analysis tools, such as oscilloscopes or signal analyzers, to measure signal quality and jitter. Consult the IDT application note AN-804, which provides guidance on signal integrity and jitter analysis for the 72T36135ML6BB. Additionally, consider using simulation tools, such as IBIS-AMI models, to simulate signal behavior and identify potential issues.
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Using a different power supply voltage than the recommended 1.2 V may affect the device's performance, power consumption, and reliability. It's essential to consult the datasheet and application notes to understand the impact of power supply voltage on the device's behavior and to ensure that the system design can accommodate any changes. IDT provides guidance on power supply voltage selection and trade-offs in the application note AN-801.