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Part Details for 7202LA12SOG by Renesas Electronics Corporation
Results Overview of 7202LA12SOG by Renesas Electronics Corporation
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
7202LA12SOG Information
7202LA12SOG by Renesas Electronics Corporation is an FIFO.
FIFOs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for 7202LA12SOG
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
800-2471-5-ND
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DigiKey | IC FIFO ASYNC 1KX9 12NS 28SOIC Min Qty: 1 Lead time: 18 Weeks Container: Tube |
102 In Stock |
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$12.8221 / $15.9400 | Buy Now |
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DISTI #
7202LA12SOG
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Avnet Americas | 1K x 9 AsyncFIFO, 5.0V - Rail/Tube (Alt: 7202LA12SOG) RoHS: Compliant Min Qty: 104 Package Multiple: 26 Lead time: 18 Weeks, 0 Days Container: Tube | 0 |
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$11.1600 | Buy Now |
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DISTI #
972-7202LA12SOG
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Mouser Electronics | FIFO 1K X 9 CMOS PARALLEL FIF RoHS: Compliant | 71 |
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$12.2400 / $16.5900 | Buy Now |
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DISTI #
7202LA12SOG
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Avnet Silica | 1K x 9 AsyncFIFO 50V (Alt: 7202LA12SOG) RoHS: Compliant Min Qty: 26 Package Multiple: 26 Lead time: 19 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for 7202LA12SOG
7202LA12SOG CAD Models
7202LA12SOG Part Data Attributes
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7202LA12SOG
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
7202LA12SOG
Renesas Electronics Corporation
1K x 9 AsyncFIFO, 5.0V, SOIC26/Tube
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | SOIC | |
| Package Description | GREEN, SOIC-28 | |
| Pin Count | 28 | |
| Manufacturer Package Code | PEG28 | |
| Reach Compliance Code | compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542320071 | |
| Factory Lead Time | 18 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Access Time-Max | 12 ns | |
| Additional Feature | RETRANSMIT | |
| Clock Frequency-Max (fCLK) | 50 MHz | |
| Cycle Time | 20 ns | |
| JESD-30 Code | R-PDSO-G28 | |
| JESD-609 Code | e3 | |
| Length | 18.3642 mm | |
| Memory Density | 9216 bit | |
| Memory IC Type | OTHER FIFO | |
| Memory Width | 9 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 1024 words | |
| Number of Words Code | 1000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1KX9 | |
| Output Enable | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP28,.5 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.048 mm | |
| Standby Current-Max | 0.005 A | |
| Supply Current-Max | 0.08 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Width | 8.763 mm |
Alternate Parts for 7202LA12SOG
This table gives cross-reference parts and alternative options found for 7202LA12SOG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 7202LA12SOG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 7202LA12TPG | Renesas Electronics Corporation | Check for Price | 1K x 9 AsyncFIFO, 5.0V, PDIP14/Tube | 7202LA12SOG vs 7202LA12TPG |
| 7202LA12SOG8 | Renesas Electronics Corporation | Check for Price | 1K x 9 AsyncFIFO, 5.0V, SOIC0/Reel | 7202LA12SOG vs 7202LA12SOG8 |
7202LA12SOG Frequently Asked Questions (FAQ)
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A 4-layer PCB with a dedicated ground plane and thermal vias is recommended for optimal thermal performance. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
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Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Ensure the device is operated within the recommended temperature range (–40°C to 125°C).
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Use 0.1 μF to 1 μF decoupling capacitors with a voltage rating of 10 V or higher. Place them as close as possible to the device's power pins, with a maximum distance of 1 cm.
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Implement ESD protection using TVS diodes or ESD arrays at the PCB level. Ensure the protection devices are rated for the maximum voltage and current of the application.
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Power sequencing should follow the recommended power-up sequence in the datasheet. Ramp-up times should be slower than 10 ms to prevent inrush currents and ensure reliable operation.