Part Details for 7201LA15JG by Integrated Device Technology Inc
Results Overview of 7201LA15JG by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
7201LA15JG Information
7201LA15JG by Integrated Device Technology Inc is an FIFO.
FIFOs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for 7201LA15JG
7201LA15JG CAD Models
7201LA15JG Part Data Attributes
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7201LA15JG
Integrated Device Technology Inc
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Datasheet
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7201LA15JG
Integrated Device Technology Inc
FIFO, 512X9, 15ns, Asynchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | QFJ | |
| Package Description | GREEN, PLASTIC, LCC-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 15 ns | |
| Additional Feature | RETRANSMIT | |
| Clock Frequency-Max (fCLK) | 40 MHz | |
| Cycle Time | 25 ns | |
| JESD-30 Code | R-PQCC-J32 | |
| JESD-609 Code | e3 | |
| Length | 13.97 mm | |
| Memory Density | 4608 bit | |
| Memory IC Type | OTHER FIFO | |
| Memory Width | 9 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 512 words | |
| Number of Words Code | 512 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512X9 | |
| Output Characteristics | 3-STATE | |
| Output Enable | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC32,.5X.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.55 mm | |
| Standby Current-Max | 0.005 A | |
| Supply Current-Max | 0.08 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Matte Tin (Sn) - annealed | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 11.43 mm |
Alternate Parts for 7201LA15JG
This table gives cross-reference parts and alternative options found for 7201LA15JG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 7201LA15JG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 7201LA15JG | Renesas Electronics Corporation | Check for Price | FIFO, 512X9, 15ns, Asynchronous, CMOS, PQCC32 | 7201LA15JG vs 7201LA15JG |
| 7201LA15JI | Integrated Device Technology Inc | Check for Price | PLCC-32, Tube | 7201LA15JG vs 7201LA15JI |
| IDT7201LA15JG | Integrated Device Technology Inc | Check for Price | FIFO, 512X9, 15ns, Asynchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32 | 7201LA15JG vs IDT7201LA15JG |
| IDT7201LA15J | Integrated Device Technology Inc | Check for Price | FIFO, 512X9, 15ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | 7201LA15JG vs IDT7201LA15J |
| IDT7201LA15JGI | Integrated Device Technology Inc | Check for Price | FIFO, 512X9, 15ns, Asynchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32 | 7201LA15JG vs IDT7201LA15JGI |
| 7201SA15J | Integrated Device Technology Inc | Check for Price | FIFO, 512X9, 15ns, Asynchronous, CMOS, PDSO28 | 7201LA15JG vs 7201SA15J |
| 7201LA15JGI8 | Renesas Electronics Corporation | Check for Price | 512 x 9 AsyncFIFO, 5.0V, PLCC0/Reel | 7201LA15JG vs 7201LA15JGI8 |
| IDT7201SA15J8 | Integrated Device Technology Inc | Check for Price | FIFO, 512X9, 15ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | 7201LA15JG vs IDT7201SA15J8 |
| IDT7201SA15J | Integrated Device Technology Inc | Check for Price | FIFO, 512X9, 15ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | 7201LA15JG vs IDT7201SA15J |
7201LA15JG Frequently Asked Questions (FAQ)
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A good PCB layout for the 7201LA15JG should prioritize signal integrity, minimize noise, and ensure proper power supply decoupling. A 4-layer PCB with a solid ground plane and separate power planes is recommended. Keep sensitive signals away from noisy components and ensure that the clock signal has a clear return path to the ground plane.
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To ensure reliable operation in high-temperature environments, follow proper thermal management practices. Ensure good airflow around the device, use a heat sink if necessary, and avoid exceeding the maximum junction temperature (Tj) specified in the datasheet. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
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The 7201LA15JG can be a source of electromagnetic interference (EMI) due to its high-frequency operation. To mitigate EMI/EMC issues, use proper shielding, keep sensitive components away from the device, and ensure that the PCB layout is optimized for signal integrity. Additionally, consider using EMI filters or shielding cans to reduce emissions.
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The 7201LA15JG is not specifically designed or tested for radiation hardness. If you need a radiation-hardened device, consider using a different component that is specifically designed and qualified for such applications. Consult with the manufacturer or a radiation effects expert to determine the suitability of the device for your specific application.
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To troubleshoot issues with the 7201LA15JG, start by reviewing the datasheet and application notes to ensure that the device is being used within its specified operating conditions. Check the power supply, clock signal, and input/output signals for any anomalies. Use oscilloscopes, logic analyzers, or other diagnostic tools to identify the root cause of the issue. Consult with the manufacturer's support team or a qualified engineer if the issue persists.