Part Details for 71124S20YGI by Integrated Device Technology Inc
Results Overview of 71124S20YGI by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
71124S20YGI Information
71124S20YGI by Integrated Device Technology Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for 71124S20YGI
71124S20YGI CAD Models
71124S20YGI Part Data Attributes
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71124S20YGI
Integrated Device Technology Inc
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Datasheet
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71124S20YGI
Integrated Device Technology Inc
SOJ-32, Tube
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | SOJ | |
| Package Description | 0.400 INCH, GREEN, PLASTIC, SOJ-32 | |
| Pin Count | 32 | |
| Manufacturer Package Code | PBG32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Date Of Intro | 1996-06-01 | |
| Access Time-Max | 20 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDSO-J32 | |
| JESD-609 Code | e3 | |
| Length | 20.955 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOJ | |
| Package Equivalence Code | SOJ32,.44 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.683 mm | |
| Standby Current-Max | 0.01 A | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.14 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 10.16 mm |
Alternate Parts for 71124S20YGI
This table gives cross-reference parts and alternative options found for 71124S20YGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 71124S20YGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| EDI88128LPS20NM | Microsemi Corporation | Check for Price | Standard SRAM, 128KX8, 20ns, CMOS, CDSO32, CERAMIC, SOJ-32 | 71124S20YGI vs EDI88128LPS20NM |
| EDI88130CS20NI | Microsemi Corporation | Check for Price | Standard SRAM, 128KX8, 20ns, CMOS, CDSO32, CERAMIC, SOJ-32 | 71124S20YGI vs EDI88130CS20NI |
| 5962-8959839MYA | Microsemi Corporation | Check for Price | Standard SRAM, 128KX8, 20ns, CMOS, SOJ-32 | 71124S20YGI vs 5962-8959839MYA |
| EDI88128CS20NI | Microsemi Corporation | Check for Price | Standard SRAM, 128KX8, 20ns, CMOS, CDSO32, CERAMIC, SOJ-32 | 71124S20YGI vs EDI88128CS20NI |
| 5962-8959840MYA | Microsemi Corporation | Check for Price | Standard SRAM, 128KX8, 20ns, CMOS, SOJ-32 | 71124S20YGI vs 5962-8959840MYA |
| 5962-8959840MYX | Microsemi Corporation | Check for Price | Standard SRAM, 128KX8, 20ns, CMOS, SOJ-32 | 71124S20YGI vs 5962-8959840MYX |
| 5962-8959839MYX | Minco Technology Labs LLC | Check for Price | Standard SRAM, 128KX8, 20ns, CMOS, SOJ-32 | 71124S20YGI vs 5962-8959839MYX |
| 5962-8959840MYX | Minco Technology Labs LLC | Check for Price | Standard SRAM, 128KX8, 20ns, CMOS, SOJ-32 | 71124S20YGI vs 5962-8959840MYX |
| 5962-8959821MYX | Minco Technology Labs LLC | Check for Price | Standard SRAM, 128KX8, 20ns, CMOS, CDSO32, CERAMIC, SOJ-32 | 71124S20YGI vs 5962-8959821MYX |
71124S20YGI Frequently Asked Questions (FAQ)
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A good PCB layout for the 71124S20YGI should prioritize signal integrity, minimize noise, and ensure proper power supply decoupling. IDT recommends using a 4-layer PCB with a solid ground plane, and placing the device near the center of the board. Additionally, use short, direct traces for clock and data signals, and avoid routing them near the power supply or noisy areas.
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To ensure reliable operation across the entire operating temperature range (-40°C to 85°C), it's essential to follow proper thermal management practices. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if the device will be operating in high-temperature environments. Also, verify that the PCB and surrounding components are rated for the same temperature range.
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While the 71124S20YGI is specified for 20 MHz operation, using a lower or higher clock frequency may affect its performance. A lower clock frequency may reduce power consumption but also decrease the device's bandwidth. A higher clock frequency may increase bandwidth but also increase power consumption and potentially introduce jitter or other signal integrity issues. Consult with IDT or a qualified engineer to determine the feasibility of using a non-standard clock frequency.
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While the 71124S20YGI is primarily designed for PCIe applications, its flexibility and programmability make it suitable for other high-speed interfaces, such as SATA, SAS, or custom protocols. However, this would require custom firmware development and may require additional external components. Consult with IDT or a qualified engineer to determine the feasibility of using the device in a non-PCIe application.
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As a high-speed device, the 71124S20YGI can be a source of electromagnetic interference (EMI) and radio-frequency interference (RFI). To minimize these effects, follow proper PCB layout and shielding practices, use EMI filters or chokes, and ensure that the device is properly grounded. Additionally, consider using EMI-absorbing materials or shielding cans to enclose the device and surrounding components.