Part Details for 70V35L20PFGI by Integrated Device Technology Inc
Results Overview of 70V35L20PFGI by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
70V35L20PFGI Information
70V35L20PFGI by Integrated Device Technology Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for 70V35L20PFGI
70V35L20PFGI CAD Models
70V35L20PFGI Part Data Attributes
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70V35L20PFGI
Integrated Device Technology Inc
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Datasheet
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70V35L20PFGI
Integrated Device Technology Inc
TQFP-100, Tray
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | TQFP | |
Package Description | 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100 | |
Pin Count | 100 | |
Manufacturer Package Code | PNG100 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Date Of Intro | 1992-01-01 | |
Access Time-Max | 20 ns | |
I/O Type | COMMON | |
JESD-30 Code | S-PQFP-G100 | |
JESD-609 Code | e3 | |
Length | 14 mm | |
Memory Density | 147456 bit | |
Memory IC Type | MULTI-PORT SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 100 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8KX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP100,.63SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.6 mm | |
Standby Current-Max | 0.005 A | |
Standby Voltage-Min | 3 V | |
Supply Current-Max | 0.195 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 14 mm |
Alternate Parts for 70V35L20PFGI
This table gives cross-reference parts and alternative options found for 70V35L20PFGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V35L20PFGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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IDT70V35S20PFG | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 8KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100 | 70V35L20PFGI vs IDT70V35S20PFG |
IDT7035L20PFG8 | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 8KX18, 20ns, CMOS, PQFP100, TQFP-100 | 70V35L20PFGI vs IDT7035L20PFG8 |
70V35TS20PF | Integrated Device Technology Inc | Check for Price | Multi-Port SRAM, 8KX18, 20ns, CMOS, PQFP100 | 70V35L20PFGI vs 70V35TS20PF |
70V35S20PFGI8 | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM | 70V35L20PFGI vs 70V35S20PFGI8 |
IDT70V35L20PFI | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 8KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 70V35L20PFGI vs IDT70V35L20PFI |
IDT70V35TL20PFI | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 8KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 70V35L20PFGI vs IDT70V35TL20PFI |
IDT7035S20PFGI | Integrated Device Technology Inc | Check for Price | Dual-Port SRAM, 8KX8, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | 70V35L20PFGI vs IDT7035S20PFGI |
70V35L20PFGI Frequently Asked Questions (FAQ)
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A good PCB layout for the 70V35L20PFGI should prioritize signal integrity, minimize noise, and ensure proper power distribution. IDT recommends using a 4-layer PCB with a solid ground plane, separating analog and digital signals, and using decoupling capacitors close to the device.
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The 70V35L20PFGI has a thermal pad on the bottom, which should be connected to a solid ground plane or a thermal relief pattern on the PCB. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if operating in high-temperature environments.
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The input clock signal should be a differential signal with a frequency range of 10 MHz to 200 MHz, and an amplitude of 1.8V to 3.3V. The clock signal should also have a rise and fall time of less than 1 ns, and a duty cycle of 40% to 60%.
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The 70V35L20PFGI has a programmable PLL that allows for output frequency configuration. This can be done using the device's control pins, such as the PLL_BYPASS and PLL_DIVIDE pins, or through the use of an external controller or microcontroller.
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The 70V35L20PFGI is a high-frequency device that can generate electromagnetic interference (EMI) and radio-frequency interference (RFI). To minimize these effects, use proper shielding, grounding, and decoupling techniques, and ensure that the device is placed away from sensitive components and antennas.