Part Details for 6116SA45DB by Integrated Device Technology Inc
Results Overview of 6116SA45DB by Integrated Device Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
6116SA45DB Information
6116SA45DB by Integrated Device Technology Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for 6116SA45DB
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-6116SA45DB-ND
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DigiKey | IC SRAM 16KBIT PARALLEL 24CDIP Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT | Temporarily Out of Stock |
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Buy Now |
Part Details for 6116SA45DB
6116SA45DB CAD Models
6116SA45DB Part Data Attributes
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6116SA45DB
Integrated Device Technology Inc
Buy Now
Datasheet
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6116SA45DB
Integrated Device Technology Inc
CDIP-24, Tube
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | CDIP | |
| Package Description | DIP-24 | |
| Pin Count | 24 | |
| Manufacturer Package Code | CD24 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Date Of Intro | 1986-09-17 | |
| Access Time-Max | 45 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T24 | |
| JESD-609 Code | e0 | |
| Length | 32.004 mm | |
| Memory Density | 16384 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 240 | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Seated Height-Max | 4.826 mm | |
| Standby Current-Max | 0.01 A | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 6116SA45DB
This table gives cross-reference parts and alternative options found for 6116SA45DB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 6116SA45DB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 8403609JX | Integrated Device Technology Inc | Check for Price | Standard SRAM, 2KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 | 6116SA45DB vs 8403609JX |
| IDT6116LA45DGB | Integrated Device Technology Inc | Check for Price | Standard SRAM, 2KX8, 45ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | 6116SA45DB vs IDT6116LA45DGB |
| 8403609JA | QP Semiconductor | Check for Price | Standard SRAM, 2KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 | 6116SA45DB vs 8403609JA |
6116SA45DB Frequently Asked Questions (FAQ)
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A good PCB layout for the 6116SA45DB should ensure that the power and ground pins are connected to a solid power and ground plane, respectively. Additionally, the input and output tracks should be kept short and away from noise sources. A 4-layer PCB with a dedicated power and ground plane is recommended.
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The 6116SA45DB requires a controlled power-up and power-down sequence to prevent damage. Ensure that the VCC pin is powered up before the VTT pin, and that the VTT pin is powered down before the VCC pin. A power-up sequence of VCC, VTT, and then input signals is recommended.
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The 6116SA45DB has an operating temperature range of -40°C to +85°C. However, it's recommended to operate the device within a temperature range of 0°C to +70°C for optimal performance and reliability.
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The 6116SA45DB has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment is properly grounded.
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The 6116SA45DB requires a termination scheme to prevent signal reflections and ensure signal integrity. A series termination scheme with a 50Ω resistor is recommended for the output signals.