Part Details for 6116SA35TDB by Integrated Device Technology Inc
Results Overview of 6116SA35TDB by Integrated Device Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
6116SA35TDB Information
6116SA35TDB by Integrated Device Technology Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for 6116SA35TDB
| Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | Electronic Component RoHS: Not Compliant |
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RFQ |
Part Details for 6116SA35TDB
6116SA35TDB CAD Models
6116SA35TDB Part Data Attributes
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6116SA35TDB
Integrated Device Technology Inc
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Datasheet
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6116SA35TDB
Integrated Device Technology Inc
CDIP-24, Tube
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | CDIP | |
| Package Description | DIP, DIP24,.3 | |
| Pin Count | 24 | |
| Manufacturer Package Code | SD24 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Date Of Intro | 1988-01-01 | |
| Access Time-Max | 35 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T24 | |
| JESD-609 Code | e0 | |
| Length | 32.004 mm | |
| Memory Density | 16384 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 240 | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.01 A | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.115 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for 6116SA35TDB
This table gives cross-reference parts and alternative options found for 6116SA35TDB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 6116SA35TDB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 8403614LX | QP Semiconductor | Check for Price | Standard SRAM, 2KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 | 6116SA35TDB vs 8403614LX |
| 8403614LA | QP Semiconductor | Check for Price | Standard SRAM, 2KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 | 6116SA35TDB vs 8403614LA |
6116SA35TDB Frequently Asked Questions (FAQ)
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The recommended PCB layout for the 6116SA35TDB can be found in the IDT application note 'PCB Layout Recommendations for IDT Clock Products' (available on the IDT website). It provides guidelines for signal routing, decoupling, and thermal management to ensure optimal performance and reliability.
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The 6116SA35TDB requires a differential input signal with a amplitude of 100-400 mV for proper operation. Ensure that the input signal is within this range and that the input signal source is properly terminated to prevent signal reflection and ensure signal integrity.
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The 6116SA35TDB can drive up to 16 differential outputs, each with a maximum load of 50 ohms. However, the total output load should not exceed 800 ohms to ensure that the part can maintain its output amplitude and frequency accuracy.
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The output frequency of the 6116SA35TDB can be configured using the external feedback pin (FB) and the internal feedback resistors. The output frequency can be set to a specific value by selecting the appropriate feedback resistors and configuring the FB pin accordingly. Refer to the datasheet and application notes for more information.
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The 6116SA35TDB is a high-frequency part that generates heat during operation. To ensure reliable operation, it's essential to implement a thermal management strategy, such as using a heat sink, thermal pad, or thermal interface material, to keep the junction temperature below the recommended maximum value of 105°C.