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Field Programmable Gate Array, 110000-Cell, CMOS, PBGA896, ROHS COMPLIANT, FBGA-896
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5CSTFD6D5F31I7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
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Win Source Electronics | IC SOC CORTEX-A9 800MHZ 896FBGA / Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series FPGA - 110K Logic Elements 800MHz 896-FBGA (31x31) | 324 |
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5CSTFD6D5F31I7N
Intel Corporation
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Datasheet
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5CSTFD6D5F31I7N
Intel Corporation
Field Programmable Gate Array, 110000-Cell, CMOS, PBGA896, ROHS COMPLIANT, FBGA-896
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | ROHS COMPLIANT, FBGA-896 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
JESD-30 Code | S-PBGA-B896 | |
JESD-609 Code | e1 | |
Length | 31 mm | |
Moisture Sensitivity Level | 3 | |
Number of Inputs | 469 | |
Number of Outputs | 469 | |
Number of Terminals | 896 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 4191 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA896,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Seated Height-Max | 2 mm | |
Supply Voltage-Max | 1.13 V | |
Supply Voltage-Min | 1.07 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 31 mm |
The maximum operating temperature range for the 5CSTFD6D5F31I7N is -40°C to 100°C.
Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset.
Intel provides guidelines for PCB layout and routing in the Cyclone V SoC FPGA Development Kit User Guide. It's essential to follow these guidelines to ensure signal integrity and minimize noise.
To optimize power consumption, use the Intel Quartus II Power Play Early Power Estimator (EPE) tool to analyze and optimize power consumption during the design process. Additionally, consider using power-saving features like clock gating and dynamic voltage and frequency scaling.
Intel recommends using a combination of high-frequency and low-frequency decoupling capacitors, with values ranging from 0.01 μF to 10 μF, placed close to the FPGA's power pins.