Part Details for 5CSEMA5F31I7N by Intel Corporation
Results Overview of 5CSEMA5F31I7N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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5CSEMA5F31I7N Information
5CSEMA5F31I7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CSEMA5F31I7N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 44 |
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RFQ |
Part Details for 5CSEMA5F31I7N
5CSEMA5F31I7N CAD Models
5CSEMA5F31I7N Part Data Attributes
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5CSEMA5F31I7N
Intel Corporation
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Datasheet
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5CSEMA5F31I7N
Intel Corporation
Field Programmable Gate Array, 85000-Cell, CMOS, PBGA896, ROHS COMPLIANT, FBGA-896
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-896 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B896 | |
| JESD-609 Code | e1 | |
| Length | 31 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 469 | |
| Number of Outputs | 469 | |
| Number of Terminals | 896 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 3207 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm |
5CSEMA5F31I7N Frequently Asked Questions (FAQ)
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Intel provides a reference design guide for the 5CSEMA5F31I7N, which includes recommendations for PCB layout, thermal design, and power delivery. It's essential to follow these guidelines to ensure optimal performance, power efficiency, and thermal management.
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To optimize power consumption, use the Intel Quartus Prime software to analyze and optimize the design's power consumption. Additionally, consider using power-saving features like clock gating, dynamic voltage and frequency scaling, and power gating. Implementing these techniques can significantly reduce power consumption.
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To ensure signal integrity and mitigate EMI, follow best practices such as using differential signaling, impedance matching, and shielding. Also, consider using Intel's signal integrity and EMI analysis tools to simulate and optimize the design.
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Implement a secure boot mechanism using Intel's Boot Loader Development Kit (BLDK) and follow the guidelines for secure boot and firmware updates. Additionally, consider using cryptographic techniques like encryption and authentication to ensure the integrity of the boot process.
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For high-performance applications, it's essential to consider thermal management techniques like heat sinks, thermal interfaces, and airflow management. Intel provides thermal design guidelines and thermal models for the 5CSEMA5F31I7N, which can help optimize thermal performance.