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Part Details for 5CSEBA6U23C7N by Intel Corporation
Results Overview of 5CSEBA6U23C7N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
5CSEBA6U23C7N Information
5CSEBA6U23C7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CSEBA6U23C7N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip 1 Exchange | INSTOCK | 1780 |
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RFQ |
Part Details for 5CSEBA6U23C7N
5CSEBA6U23C7N CAD Models
5CSEBA6U23C7N Part Data Attributes
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5CSEBA6U23C7N
Intel Corporation
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Datasheet
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5CSEBA6U23C7N
Intel Corporation
Field Programmable Gate Array, 110000-Cell, CMOS, PBGA672, ROHS COMPLIANT, UBGA-672
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, UBGA-672 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B672 | |
| Length | 23 mm | |
| Number of Inputs | 326 | |
| Number of Outputs | 326 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 4191 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA672,28X28,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.85 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 23 mm |
5CSEBA6U23C7N Frequently Asked Questions (FAQ)
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Intel provides a PCB design guide and thermal management guidelines in their documentation, but it's essential to consult with experienced engineers and perform thermal simulations to ensure optimal design.
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Use Intel's PowerPlay Early Power Estimator (EPE) tool to estimate power consumption. Optimize your design by reducing clock frequencies, using low-power modes, and implementing power-gating techniques.
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Use Intel's Secure Device Manager to encrypt and authenticate the FPGA's configuration. Implement secure boot mechanisms, and consider using a secure element, such as a Trusted Platform Module (TPM), to protect your IP.
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Follow Intel's guidelines for transceiver calibration and optimization. Implement error correction mechanisms, such as CRC and FEC, and consider using a redundant transmission scheme to ensure data integrity.
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Consult Intel's documentation for specific guidelines on using the hard IP blocks, such as the DSP and PCIe blocks. Be aware of any limitations on resource utilization, clock frequencies, and data widths.