Part Details for 5CSEBA4U23C8N by Intel Corporation
Results Overview of 5CSEBA4U23C8N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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5CSEBA4U23C8N Information
5CSEBA4U23C8N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CSEBA4U23C8N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip 1 Exchange | INSTOCK | 1780 |
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RFQ |
Part Details for 5CSEBA4U23C8N
5CSEBA4U23C8N CAD Models
5CSEBA4U23C8N Part Data Attributes
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5CSEBA4U23C8N
Intel Corporation
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Datasheet
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5CSEBA4U23C8N
Intel Corporation
Field Programmable Gate Array, 40000-Cell, CMOS, PBGA672, ROHS COMPLIANT, UBGA-672
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, UBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B672 | |
| Length | 23 mm | |
| Number of Inputs | 326 | |
| Number of Outputs | 326 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1588 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA672,28X28,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.85 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 23 mm |
5CSEBA4U23C8N Frequently Asked Questions (FAQ)
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Intel provides a reference design guide for PCB layout, which includes guidelines for signal integrity, power distribution, and thermal management.
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Use the Intel Power Analyzer tool to estimate power consumption, and implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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Implement a secure boot process using the FPGA's built-in security features, such as the Root of Trust (RoT) and the Secure Boot mechanism, to ensure the authenticity and integrity of the FPGA's configuration.
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Use the Intel SoC Embedded Design Suite (EDS) to debug and troubleshoot configuration issues, and leverage the FPGA's built-in debug features, such as the Configuration Debug Interface (CDI).
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Ensure proper thermal management by providing adequate heat sinks, thermal interfaces, and airflow, and by monitoring the FPGA's temperature using the on-chip thermal sensors.