Part Details for 5CSEBA2U23C8N by Intel Corporation
Results Overview of 5CSEBA2U23C8N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
5CSEBA2U23C8N Information
5CSEBA2U23C8N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CSEBA2U23C8N
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Chip 1 Exchange | INSTOCK | 1780 |
|
RFQ |
Part Details for 5CSEBA2U23C8N
5CSEBA2U23C8N CAD Models
5CSEBA2U23C8N Part Data Attributes
|
|
5CSEBA2U23C8N
Intel Corporation
Buy Now
Datasheet
|
Compare Parts:
5CSEBA2U23C8N
Intel Corporation
Field Programmable Gate Array, 25000-Cell, CMOS, PBGA672, ROHS COMPLIANT, UBGA-672
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, UBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B672 | |
| Length | 23 mm | |
| Number of Inputs | 326 | |
| Number of Outputs | 326 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 943 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA672,28X28,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.85 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 23 mm |
5CSEBA2U23C8N Frequently Asked Questions (FAQ)
-
Intel provides a reference design guide for PCB layout, which includes guidelines for signal integrity, power distribution, and thermal management. It's essential to follow these guidelines to ensure optimal performance and reliability.
-
To minimize power consumption, use the Intel PowerPlay power management technology, which allows you to dynamically adjust voltage and frequency. Additionally, optimize your design to minimize switching activity, use clock gating, and take advantage of the device's low-power modes.
-
The 5CSEBA2U23C8N has a maximum junction temperature of 100°C. Ensure good airflow, use a heat sink or thermal interface material, and design your PCB to dissipate heat efficiently. Intel provides thermal modeling tools to help with thermal design.
-
Use Intel's signal integrity guidelines, which include recommendations for trace length, impedance, and termination. Also, use simulation tools like IBIS-AMI models to analyze and optimize your design for signal integrity.
-
The 5CSEBA2U23C8N has a range of security features, including AES encryption, secure boot, and a hardware-based root of trust. Intel also provides a Secure Boot mechanism to ensure the authenticity and integrity of the FPGA's configuration.