Part Details for 5CSEBA2U23C7SN by Intel Corporation
Results Overview of 5CSEBA2U23C7SN by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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5CSEBA2U23C7SN Information
5CSEBA2U23C7SN by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CSEBA2U23C7SN
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 911 |
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RFQ |
Part Details for 5CSEBA2U23C7SN
5CSEBA2U23C7SN CAD Models
5CSEBA2U23C7SN Part Data Attributes
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5CSEBA2U23C7SN
Intel Corporation
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Datasheet
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5CSEBA2U23C7SN
Intel Corporation
Field Programmable Gate Array, 25000-Cell, CMOS, PBGA672, ROHS COMPLIANT, UBGA-672
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, UBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B672 | |
| Length | 23 mm | |
| Number of Inputs | 326 | |
| Number of Outputs | 326 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 943 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA672,28X28,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.85 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 23 mm |
5CSEBA2U23C7SN Frequently Asked Questions (FAQ)
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Intel recommends a 4-6 layer PCB stack-up with a minimum of two power planes and two ground planes. The top and bottom layers should be used for signal routing, and the inner layers should be used for power and ground planes. Additionally, Intel provides a PCB design guide with specific layout recommendations for the 5CSEBA2U23C7SN.
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To optimize power consumption, Intel recommends using the PowerPlay Early Power Estimator (EPE) tool to estimate power consumption based on your design. You can also use the Intel Quartus Prime Power Analyzer to analyze and optimize power consumption during the design process. Additionally, consider using power-saving features like clock gating and dynamic voltage and frequency scaling.
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The 5CSEBA2U23C7SN has a maximum junction temperature of 100°C. Intel recommends using a heat sink with a thermal interface material to ensure efficient heat transfer. The PCB should also be designed to minimize thermal resistance and ensure good airflow around the device. Intel provides thermal management guidelines and thermal models to help with design and simulation.
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To ensure reliable configuration and boot-up, Intel recommends using a robust configuration scheme, such as the Intel Quartus Prime configuration scheme, and following the guidelines for configuration pin connections and voltage supply sequencing. Additionally, consider using a configuration device, such as the Intel EPCQ-L, to store the configuration data.
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Intel recommends following the guidelines for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) in the Intel Quartus Prime Handbook. This includes using shielding, filtering, and grounding techniques to minimize electromagnetic emissions and susceptibility. Additionally, consider using Intel's EMC modeling and simulation tools to analyze and optimize your design.