Part Details for 5CSEBA2U23A7N by Intel Corporation
Results Overview of 5CSEBA2U23A7N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
5CSEBA2U23A7N Information
5CSEBA2U23A7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CSEBA2U23A7N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip 1 Exchange | INSTOCK | 1780 |
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RFQ |
Part Details for 5CSEBA2U23A7N
5CSEBA2U23A7N CAD Models
5CSEBA2U23A7N Part Data Attributes
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5CSEBA2U23A7N
Intel Corporation
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Datasheet
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5CSEBA2U23A7N
Intel Corporation
Field Programmable Gate Array, 25000-Cell, CMOS, PBGA672, ROHS COMPLIANT, UBGA-672
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, UBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B672 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Number of Inputs | 326 | |
| Number of Outputs | 326 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 943 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA672,28X28,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.85 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 23 mm |
Alternate Parts for 5CSEBA2U23A7N
This table gives cross-reference parts and alternative options found for 5CSEBA2U23A7N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5CSEBA2U23A7N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 5CSEBA2U23A7N | Altera Corporation | Check for Price | Field Programmable Gate Array, 25000-Cell, CMOS, PBGA672, ROHS COMPLIANT, UBGA-672 | 5CSEBA2U23A7N vs 5CSEBA2U23A7N |
5CSEBA2U23A7N Frequently Asked Questions (FAQ)
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A multi-layer PCB with a solid ground plane and careful signal routing is recommended to minimize noise and ensure signal integrity.
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Use the Intel PowerPlay power analysis tool to identify power-hungry components and optimize the design for low power consumption. Additionally, consider using the FPGA's built-in power-saving features, such as clock gating and dynamic voltage and frequency scaling.
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The FPGA has a maximum junction temperature of 100°C. Ensure good airflow, use a heat sink if necessary, and consider thermal interface materials to maintain a safe operating temperature.
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Use controlled impedance traces, add series terminations, and consider using differential signaling to minimize signal degradation and ensure reliable data transmission.
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Implement secure boot mechanisms, use encrypted bitstreams, and consider using the FPGA's built-in security features, such as the Secure Boot and Anti-Tamper modules, to protect against unauthorized access and IP theft.