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Part Details for 5CGXFC9D6F27I7N by Intel Corporation
Results Overview of 5CGXFC9D6F27I7N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
5CGXFC9D6F27I7N Information
5CGXFC9D6F27I7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CGXFC9D6F27I7N
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
SMC-5CGXFC9D6F27I7N
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Sensible Micro Corporation | OEM Excess 5-7 Days Leadtime, We are an AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days | 5 |
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RFQ |
Part Details for 5CGXFC9D6F27I7N
5CGXFC9D6F27I7N CAD Models
5CGXFC9D6F27I7N Part Data Attributes
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5CGXFC9D6F27I7N
Intel Corporation
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Datasheet
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5CGXFC9D6F27I7N
Intel Corporation
Field Programmable Gate Array, 301000-Cell, CMOS, PBGA672, ROHS COMPLIANT, FBGA-672
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B672 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 336 | |
| Number of Logic Cells | 301000 | |
| Number of Outputs | 336 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 11356 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm |
5CGXFC9D6F27I7N Frequently Asked Questions (FAQ)
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Intel recommends a 4-6 layer PCB stackup with a minimum of two power planes and two signal layers. A detailed layout guide is available in the Intel FPGA PCB Design Guidelines document.
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Use the Intel Power Estimator tool to estimate power consumption based on your design's specific requirements. Additionally, consider using power-saving features like clock gating, dynamic voltage and frequency scaling, and low-power modes.
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Ensure good airflow around the FPGA, use a heat sink with a thermal interface material, and consider using a fan or heat pipe for high-power designs. Intel provides thermal management guidelines in the FPGA's datasheet and application notes.
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Use a reliable configuration device like the Intel EPCQ-L device, ensure proper power sequencing, and implement a robust boot-up sequence using the FPGA's built-in boot loader or a custom boot loader.
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Follow Intel's signal integrity guidelines, use differential signaling, and implement EMI mitigation techniques like shielding, filtering, and grounding. Consider using Intel's Signal Integrity Tool to analyze and optimize your design.