Part Details for 5CGXFC5F7M11C8N by Intel Corporation
Results Overview of 5CGXFC5F7M11C8N by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
5CGXFC5F7M11C8N Information
5CGXFC5F7M11C8N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 5CGXFC5F7M11C8N
5CGXFC5F7M11C8N CAD Models
5CGXFC5F7M11C8N Part Data Attributes
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5CGXFC5F7M11C8N
Intel Corporation
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Datasheet
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5CGXFC5F7M11C8N
Intel Corporation
Field Programmable Gate Array, 77000-Cell, CMOS, PBGA301, ROHS COMPLIANT, MBGA-301
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, MBGA-301 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B301 | |
| Length | 11 mm | |
| Number of Inputs | 129 | |
| Number of Logic Cells | 77000 | |
| Number of Outputs | 129 | |
| Number of Terminals | 301 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 2908 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA301,21X21,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 11 mm |
Alternate Parts for 5CGXFC5F7M11C8N
This table gives cross-reference parts and alternative options found for 5CGXFC5F7M11C8N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5CGXFC5F7M11C8N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| 5CGXFC5F7M11C8N | Altera Corporation | Check for Price | Field Programmable Gate Array, 77000-Cell, CMOS, PBGA301, ROHS COMPLIANT, MBGA-301 | 5CGXFC5F7M11C8N vs 5CGXFC5F7M11C8N |
5CGXFC5F7M11C8N Frequently Asked Questions (FAQ)
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The 5CGXFC5F7M11C8N FPGA has an operating temperature range of 0°C to 100°C (TJ).
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Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
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Intel provides a PCB layout and routing guide for the 5CGXFC5F7M11C8N FPGA, which recommends using a 4-layer PCB with a dedicated power plane, and following specific routing guidelines for high-speed signals.
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To optimize power consumption, use the Intel Quartus Prime software to optimize the design for power, reduce clock frequencies, and use the FPGA's built-in power-saving features, such as the 'Power Aware' mode.
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Intel recommends using 0.1 μF and 10 μF decoupling capacitors, placed as close as possible to the FPGA's power pins, with a maximum distance of 1 inch.