Part Details for 5CGXBC9C6F23C7N by Intel Corporation
Results Overview of 5CGXBC9C6F23C7N by Intel Corporation
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5CGXBC9C6F23C7N Information
5CGXBC9C6F23C7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 5CGXBC9C6F23C7N
5CGXBC9C6F23C7N CAD Models
5CGXBC9C6F23C7N Part Data Attributes
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5CGXBC9C6F23C7N
Intel Corporation
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Datasheet
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5CGXBC9C6F23C7N
Intel Corporation
Field Programmable Gate Array, 301000-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-484 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 224 | |
| Number of Logic Cells | 301000 | |
| Number of Outputs | 224 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 11356 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |
5CGXBC9C6F23C7N Frequently Asked Questions (FAQ)
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The 5CGXBC9C6F23C7N FPGA has an operating temperature range of -40°C to 100°C.
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Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
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Intel provides a PCB layout and routing guide for the 5CGXBC9C6F23C7N FPGA, which recommends using a 4-layer PCB with a dedicated power plane, and following specific routing guidelines for high-speed signals.
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To optimize power consumption, use the Intel Quartus Prime software to optimize the design for power, reduce clock frequencies, and use the FPGA's built-in power management features, such as the Power Manager IP core.
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Intel recommends using the Intel Quartus Prime software to generate a programming file (.sof) and configure the FPGA using the JTAG interface or an external configuration device, such as the Intel MAX 10 FPGA Configuration Device.