Part Details for 5CGXBC3B6F23C7N by Intel Corporation
Results Overview of 5CGXBC3B6F23C7N by Intel Corporation
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Applications
Computing and Data Storage
5CGXBC3B6F23C7N Information
5CGXBC3B6F23C7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 5CGXBC3B6F23C7N
5CGXBC3B6F23C7N CAD Models
5CGXBC3B6F23C7N Part Data Attributes
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5CGXBC3B6F23C7N
Intel Corporation
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Datasheet
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5CGXBC3B6F23C7N
Intel Corporation
Field Programmable Gate Array, 31500-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-484 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B484 | |
| Length | 23 mm | |
| Number of Inputs | 208 | |
| Number of Logic Cells | 31500 | |
| Number of Outputs | 208 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1346 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 23 mm |
5CGXBC3B6F23C7N Frequently Asked Questions (FAQ)
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Intel recommends a 4-6 layer PCB stackup with a minimum of two power planes and two ground planes. The top and bottom layers should be used for signal routing, and the inner layers for power and ground planes. Additionally, Intel provides a PCB design guide and layout recommendations in the 'Intel FPGA PCB Design Guidelines' document.
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To optimize power consumption, use the Intel Power Analyzer tool to estimate power consumption and identify areas for optimization. Implement power-saving techniques such as clock gating, dynamic voltage and frequency scaling, and using low-power modes. For thermal design, ensure good airflow, use a heat sink if necessary, and follow Intel's thermal design guidelines.
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Use the Intel Quartus Prime software to configure the transceivers. Ensure that the transceiver settings match the specific application requirements. Use the 'Transceiver Toolkit' to analyze and optimize transceiver performance. Follow Intel's guidelines for transceiver configuration, clocking, and signal integrity.
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Use a secure boot mechanism such as Intel's Secure Boot or a third-party solution. Implement a boot loader that authenticates the FPGA image and ensures its integrity. Use encryption and secure storage for sensitive data. Follow Intel's guidelines for secure boot and FPGA configuration.
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Ensure that the PCB layout and signal routing meet the high-speed interface requirements. Use the Intel-provided IP cores and follow the guidelines for PCIe and Ethernet implementation. Perform signal integrity analysis and simulation to ensure reliable data transfer.