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Part Details for 5CEFA9F31C7N by Intel Corporation
Results Overview of 5CEFA9F31C7N by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
5CEFA9F31C7N Information
5CEFA9F31C7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 5CEFA9F31C7N
5CEFA9F31C7N CAD Models
5CEFA9F31C7N Part Data Attributes
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5CEFA9F31C7N
Intel Corporation
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Datasheet
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5CEFA9F31C7N
Intel Corporation
Field Programmable Gate Array, 301000-Cell, CMOS, PBGA896, ROHS COMPLIANT, FBGA-896
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-896 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B896 | |
| Length | 31 mm | |
| Number of Inputs | 488 | |
| Number of Logic Cells | 301000 | |
| Number of Outputs | 488 | |
| Number of Terminals | 896 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 11356 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 31 mm |
5CEFA9F31C7N Frequently Asked Questions (FAQ)
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Intel provides a PCB design guide and thermal management guidelines in their documentation, but it's recommended to consult with Intel's technical support or a qualified PCB design expert for specific guidance.
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Optimize power consumption by using Intel's PowerPlay Early Power Estimator (EPE) tool, and implement power-saving techniques like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, consider using a heat sink or thermal interface material to reduce thermal resistance.
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Use Intel's FPGA security features like bitstream encryption, authentication, and secure boot mechanisms. Implement access controls, secure key management, and consider using a secure boot loader. Consult Intel's security documentation and follow best practices for secure FPGA design.
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Characterize the FPGA's performance across various temperatures, voltages, and frequencies. Use Intel's device models and simulation tools to validate your design. Implement robust clocking and reset strategies, and consider using environmental sensors to monitor operating conditions.
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Use Intel's Quartus Prime design software and IP Catalog for developing and verifying IP cores. Follow Intel's recommended design flows and guidelines for IP core development, and consider using third-party EDA tools for additional functionality.