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Field Programmable Gate Array, 76500-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
5CEFA5F23I7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 5072 |
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RFQ | ||
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Chip-Germany GmbH | RoHS: Not Compliant | 85 |
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RFQ | |
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MacroQuest Electronics | ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018 | 889 |
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$52.5000 / $70.0000 | Buy Now |
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Vyrian | Programmable ICs | 84 |
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RFQ |
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5CEFA5F23I7N
Intel Corporation
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Datasheet
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5CEFA5F23I7N
Intel Corporation
Field Programmable Gate Array, 76500-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | ROHS COMPLIANT, FBGA-484 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
JESD-30 Code | S-PBGA-B484 | |
Length | 23 mm | |
Number of Inputs | 240 | |
Number of Logic Cells | 76500 | |
Number of Outputs | 240 | |
Number of Terminals | 484 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 2908 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2 mm | |
Supply Voltage-Max | 1.13 V | |
Supply Voltage-Min | 1.07 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 23 mm |
This table gives cross-reference parts and alternative options found for 5CEFA5F23I7N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5CEFA5F23I7N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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5CEFA5F23I7N | Altera Corporation | $133.6237 | Field Programmable Gate Array, 76500-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484 | 5CEFA5F23I7N vs 5CEFA5F23I7N |
The maximum operating temperature of the 5CEFA5F23I7N is typically specified in the datasheet, but if not, it's usually around 85°C to 100°C, depending on the specific application and use case.
The power management for the 5CEFA5F23I7N would depend on the specific requirements of your design. You may need to use power gating, clock gating, or dynamic voltage and frequency scaling to optimize power consumption. Consult the datasheet and application notes for more information.
The recommended PCB layout for the 5CEFA5F23I7N would depend on the specific package type and pinout. Generally, it's recommended to follow the guidelines provided in the datasheet and application notes, and to use a 4-layer or 6-layer PCB with a solid ground plane to minimize noise and EMI.
To troubleshoot issues with the 5CEFA5F23I7N, start by consulting the datasheet and application notes. Check for proper power supply, clock signal, and reset signal. Use oscilloscopes and logic analyzers to debug the signals. If the issue persists, contact Intel Corporation's support team for further assistance.
The thermal management considerations for the 5CEFA5F23I7N would depend on the specific application and use case. Generally, it's recommended to use a heat sink or a thermal interface material to dissipate heat. Consult the datasheet and application notes for more information on thermal design and management.