Datasheets
5CEFA5F23I7N by:

Field Programmable Gate Array, 76500-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484

Part Details for 5CEFA5F23I7N by Intel Corporation

Results Overview of 5CEFA5F23I7N by Intel Corporation

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5CEFA5F23I7N Information

5CEFA5F23I7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for 5CEFA5F23I7N

Part # Distributor Description Stock Price Buy
Bristol Electronics   5072
RFQ
Chip-Germany GmbH   RoHS: Not Compliant 85
RFQ
MacroQuest Electronics ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018 889
  • 1 $70.0000
  • 10 $61.2500
  • 25 $52.5000
$52.5000 / $70.0000 Buy Now
Vyrian Programmable ICs 84
RFQ

Part Details for 5CEFA5F23I7N

5CEFA5F23I7N CAD Models

5CEFA5F23I7N Part Data Attributes

5CEFA5F23I7N Intel Corporation
Buy Now Datasheet
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5CEFA5F23I7N Intel Corporation Field Programmable Gate Array, 76500-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description ROHS COMPLIANT, FBGA-484
Reach Compliance Code compliant
ECCN Code 3A991
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel
JESD-30 Code S-PBGA-B484
Length 23 mm
Number of Inputs 240
Number of Logic Cells 76500
Number of Outputs 240
Number of Terminals 484
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 2908 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Max 1.13 V
Supply Voltage-Min 1.07 V
Supply Voltage-Nom 1.1 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 23 mm

Alternate Parts for 5CEFA5F23I7N

This table gives cross-reference parts and alternative options found for 5CEFA5F23I7N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5CEFA5F23I7N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
5CEFA5F23I7N Altera Corporation $133.6237 Field Programmable Gate Array, 76500-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484 5CEFA5F23I7N vs 5CEFA5F23I7N

5CEFA5F23I7N Related Parts

5CEFA5F23I7N Frequently Asked Questions (FAQ)

  • The maximum operating temperature of the 5CEFA5F23I7N is typically specified in the datasheet, but if not, it's usually around 85°C to 100°C, depending on the specific application and use case.

  • The power management for the 5CEFA5F23I7N would depend on the specific requirements of your design. You may need to use power gating, clock gating, or dynamic voltage and frequency scaling to optimize power consumption. Consult the datasheet and application notes for more information.

  • The recommended PCB layout for the 5CEFA5F23I7N would depend on the specific package type and pinout. Generally, it's recommended to follow the guidelines provided in the datasheet and application notes, and to use a 4-layer or 6-layer PCB with a solid ground plane to minimize noise and EMI.

  • To troubleshoot issues with the 5CEFA5F23I7N, start by consulting the datasheet and application notes. Check for proper power supply, clock signal, and reset signal. Use oscilloscopes and logic analyzers to debug the signals. If the issue persists, contact Intel Corporation's support team for further assistance.

  • The thermal management considerations for the 5CEFA5F23I7N would depend on the specific application and use case. Generally, it's recommended to use a heat sink or a thermal interface material to dissipate heat. Consult the datasheet and application notes for more information on thermal design and management.

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