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Part Details for 5CEBA9F23C7N by Intel Corporation
Results Overview of 5CEBA9F23C7N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
5CEBA9F23C7N Information
5CEBA9F23C7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CEBA9F23C7N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Dynamic Solutions GmbH | OEM and CM Only | 32 |
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RFQ |
Part Details for 5CEBA9F23C7N
5CEBA9F23C7N CAD Models
5CEBA9F23C7N Part Data Attributes
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5CEBA9F23C7N
Intel Corporation
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Datasheet
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5CEBA9F23C7N
Intel Corporation
Field Programmable Gate Array, 301000-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-484 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B484 | |
| Length | 23 mm | |
| Number of Inputs | 224 | |
| Number of Logic Cells | 301000 | |
| Number of Outputs | 224 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 11356 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 23 mm |
5CEBA9F23C7N Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the 5CEBA9F23C7N is -40°C to 100°C.
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A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect power-on and power-down events and generate a reset signal for the FPGA.
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Intel recommends following the PCB layout and routing guidelines outlined in the Intel FPGA PCB Design Guidelines document, which includes guidelines for signal integrity, power distribution, and thermal management.
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To optimize timing closure, use the Intel Quartus Prime software to analyze and optimize the design's timing constraints, and consider using techniques such as pipelining, retiming, and clock domain crossing to improve timing performance.
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Intel recommends using decoupling capacitors with values ranging from 0.01 μF to 10 μF, placed as close as possible to the FPGA's power pins, to reduce power supply noise and improve system reliability.