Part Details for 5CEBA4U15C7N by Intel Corporation
Results Overview of 5CEBA4U15C7N by Intel Corporation
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- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
5CEBA4U15C7N Information
5CEBA4U15C7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 5CEBA4U15C7N
5CEBA4U15C7N CAD Models
5CEBA4U15C7N Part Data Attributes
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5CEBA4U15C7N
Intel Corporation
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Datasheet
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5CEBA4U15C7N
Intel Corporation
Field Programmable Gate Array, 49000-Cell, CMOS, PBGA324, 15 MM, ROHS COMPLIANT, UBGA-324
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 15 MM, ROHS COMPLIANT, UBGA-324 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 176 | |
| Number of Logic Cells | 49000 | |
| Number of Outputs | 176 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1848 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 15 mm |
5CEBA4U15C7N Frequently Asked Questions (FAQ)
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Intel recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for optimal thermal performance.
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Intel recommends a power-up sequence of VCCIO, then VCC, and finally VREF. A minimum delay of 10 ms is recommended between each power-up stage to ensure proper device initialization.
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Intel recommends following the PCIe and DDR3 signal integrity guidelines, including using differential pairs, minimizing trace length, and using signal shielding. Additionally, Intel provides a signal integrity toolkit to help with routing and simulation.
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Intel recommends using the device's power management features, such as clock gating and dynamic voltage and frequency scaling. Additionally, optimizing the system's power delivery network and using low-power modes can help reduce power consumption.
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Intel recommends a thermal design that takes into account the device's thermal characteristics, including its junction-to-case thermal resistance and maximum junction temperature. A heat sink or thermal interface material may be required to ensure reliable operation.