Part Details for 5CEBA4F23C8N by Intel Corporation
Results Overview of 5CEBA4F23C8N by Intel Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
5CEBA4F23C8N Information
5CEBA4F23C8N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CEBA4F23C8N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Programmable ICs | 664 |
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RFQ | |
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Win Source Electronics | IC FPGA 224 I/O 484FBGA / series Field Programmable Gate Array (FPGA) IC 224 3464192 49000 484-BGA | 820 |
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$79.8715 / $98.3034 | Buy Now |
Part Details for 5CEBA4F23C8N
5CEBA4F23C8N CAD Models
5CEBA4F23C8N Part Data Attributes
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5CEBA4F23C8N
Intel Corporation
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Datasheet
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5CEBA4F23C8N
Intel Corporation
Field Programmable Gate Array, 49000-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-484 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 224 | |
| Number of Logic Cells | 49000 | |
| Number of Outputs | 224 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1848 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |
5CEBA4F23C8N Frequently Asked Questions (FAQ)
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Intel recommends a 4-6 layer PCB stackup with a minimum of 2 mil trace width and 2 mil spacing. A dedicated ground plane and power plane are also recommended for optimal signal integrity.
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To optimize power consumption, use the Intel Power Estimator tool to estimate power consumption based on your design. Then, implement power-saving techniques such as clock gating, dynamic voltage and frequency scaling, and using low-power modes.
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Use a heat sink with a thermal interface material, ensure good airflow, and consider using a fan. Also, implement thermal management techniques such as thermal throttling and dynamic voltage and frequency scaling to reduce heat generation.
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Use a reliable configuration device such as a flash memory or a configuration FPGA. Ensure the configuration clock is stable and within the recommended frequency range. Also, implement a robust boot-up sequence with error detection and correction mechanisms.
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Use differential signaling, implement controlled impedance, and minimize signal routing layers. Also, use Intel's signal integrity tools to analyze and optimize your design.