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Part Details for 5CEBA2F23C8N by Intel Corporation
Results Overview of 5CEBA2F23C8N by Intel Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
5CEBA2F23C8N Information
5CEBA2F23C8N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CEBA2F23C8N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Programmable ICs | 380 |
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RFQ | |
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Win Source Electronics | IC FPGA 224 I/O 484FBGA | 1905 |
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$54.9845 / $82.4769 | Buy Now |
Part Details for 5CEBA2F23C8N
5CEBA2F23C8N CAD Models
5CEBA2F23C8N Part Data Attributes
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5CEBA2F23C8N
Intel Corporation
Buy Now
Datasheet
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5CEBA2F23C8N
Intel Corporation
Field Programmable Gate Array, 25000-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 224 | |
| Number of Logic Cells | 25000 | |
| Number of Outputs | 224 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 943 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |
5CEBA2F23C8N Frequently Asked Questions (FAQ)
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Intel recommends a 4-6 layer PCB stackup with a minimum of two power planes and two signal layers. A detailed layout guide is available in the Intel FPGA PCB Design Guidelines document.
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Use the Intel Power Estimator tool to estimate power consumption based on your design's specific requirements. Additionally, consider using power-saving features like clock gating, dynamic voltage and frequency scaling, and low-power modes.
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Ensure good airflow around the FPGA, use a heat sink with a thermal interface material, and consider using a fan or heat pipe for high-power designs. Intel provides thermal management guidelines in the FPGA datasheet and application notes.
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Use a reliable configuration device, such as a flash memory or an external memory device. Ensure the configuration clock is stable and within the recommended frequency range. Also, implement a robust boot-up sequence and consider using a watchdog timer.
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Use differential signaling, keep clock lines short, and avoid crossing clock lines with other signals. Implement EMI mitigation techniques like shielding, filtering, and grounding. Intel provides signal integrity guidelines in the FPGA datasheet and application notes.