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Part Details for 5CEBA2F23C7N by Intel Corporation
Results Overview of 5CEBA2F23C7N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
5CEBA2F23C7N Information
5CEBA2F23C7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CEBA2F23C7N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Programmable ICs | 75 |
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RFQ |
Part Details for 5CEBA2F23C7N
5CEBA2F23C7N CAD Models
5CEBA2F23C7N Part Data Attributes
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5CEBA2F23C7N
Intel Corporation
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Datasheet
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5CEBA2F23C7N
Intel Corporation
Field Programmable Gate Array, 25000-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-484 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B484 | |
| Length | 23 mm | |
| Number of Inputs | 224 | |
| Number of Logic Cells | 25000 | |
| Number of Outputs | 224 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 943 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 23 mm |
5CEBA2F23C7N Frequently Asked Questions (FAQ)
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Intel recommends a 4-6 layer PCB stackup with a minimum of two power planes and two ground planes. A minimum of 10 mils (0.25 mm) spacing between signal traces and a maximum of 20 mils (0.5 mm) via diameter is recommended for optimal signal integrity.
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To optimize power consumption, use the Intel Power Estimator tool to estimate power consumption based on your design. Then, implement power-saving techniques such as clock gating, dynamic voltage and frequency scaling, and using low-power modes when possible.
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Use a heat sink with a thermal interface material (TIM) and ensure good airflow around the FPGA. Keep the ambient temperature below 85°C and ensure the FPGA's junction temperature remains below 100°C. Use thermal simulation tools to optimize the thermal design.
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Use a reliable configuration device such as a flash memory or a configuration FPGA. Ensure the configuration clock is stable and within the recommended frequency range. Implement a robust boot-up sequence and use error detection and correction mechanisms to ensure reliable configuration.
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Use differential signaling, impedance-controlled traces, and terminations. Keep high-speed signals away from noise sources and use shielding when necessary. Use simulation tools to optimize signal integrity and ensure signal quality.