Part Details for 5AGXFB7H4F35C5N by Intel Corporation
Results Overview of 5AGXFB7H4F35C5N by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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5AGXFB7H4F35C5N Information
5AGXFB7H4F35C5N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 5AGXFB7H4F35C5N
5AGXFB7H4F35C5N CAD Models
5AGXFB7H4F35C5N Part Data Attributes
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5AGXFB7H4F35C5N
Intel Corporation
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Datasheet
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5AGXFB7H4F35C5N
Intel Corporation
Field Programmable Gate Array, 504000 CLBs, 503500-Cell, CMOS, PBGA1152, 35 MM, ROHS COMPLIANT, FBGA-1152
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B1152 | |
| JESD-609 Code | e1 | |
| Length | 35 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 19024 | |
| Number of Inputs | 704 | |
| Number of Logic Cells | 504000 | |
| Number of Outputs | 704 | |
| Number of Terminals | 1152 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 19024 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.7 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm |
Alternate Parts for 5AGXFB7H4F35C5N
This table gives cross-reference parts and alternative options found for 5AGXFB7H4F35C5N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5AGXFB7H4F35C5N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| 5AGXFB7H4F35I5P | Intel Corporation | Check for Price | Field Programmable Gate Array, 504000-Cell, PBGA1152, FBGA-1152 | 5AGXFB7H4F35C5N vs 5AGXFB7H4F35I5P |
| 5AGXFB7H4F35C5P | Intel Corporation | Check for Price | Field Programmable Gate Array, 504000-Cell, PBGA1152, FBGA-1152 | 5AGXFB7H4F35C5N vs 5AGXFB7H4F35C5P |
5AGXFB7H4F35C5N Frequently Asked Questions (FAQ)
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Intel provides a PCB design guide for the 5AGXFB7H4F35C5N, which recommends a 4-6 layer stackup with a minimum of 2 mil trace width and 2 mil spacing. Additionally, Intel suggests using a high-speed PCB material with a dielectric constant of 3.5-4.5.
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To optimize power consumption, Intel recommends using the PowerPlay Early Power Estimator (EPE) tool to estimate power consumption during design. For thermal management, Intel suggests using a heat sink with a thermal interface material and ensuring good airflow around the device.
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The HPS in the 5AGXFB7H4F35C5N has limitations on memory bandwidth, cache size, and peripherals. Engineers should carefully evaluate their system requirements and consider using the FPGA fabric for tasks that require high performance or low latency.
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Intel recommends using a secure boot mechanism, such as the Intel FPGA Secure Boot, to ensure the authenticity and integrity of the FPGA configuration. Additionally, engineers should follow Intel's guidelines for configuration and boot sequence to prevent errors and ensure reliable operation.
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Intel recommends using the Intel Quartus Prime software for design development and debugging. Engineers should also use the FPGA's built-in debugging features, such as the Signal Tap logic analyzer, and implement testbenches and assertions to verify design functionality.