Part Details for 5PB1104PGGI by Integrated Device Technology Inc
Results Overview of 5PB1104PGGI by Integrated Device Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
5PB1104PGGI Information
5PB1104PGGI by Integrated Device Technology Inc is a Clock Driver.
Clock Drivers are under the broader part category of Logic Components.
Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.
Price & Stock for 5PB1104PGGI
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Logic ICs | 1461 |
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RFQ |
Part Details for 5PB1104PGGI
5PB1104PGGI CAD Models
5PB1104PGGI Part Data Attributes
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5PB1104PGGI
Integrated Device Technology Inc
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Datasheet
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5PB1104PGGI
Integrated Device Technology Inc
TSSOP-8, Tube
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | TSSOP | |
Package Description | TSSOP-8 | |
Pin Count | 8 | |
Manufacturer Package Code | PGG8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Additional Feature | IT ALSO OPERATES WITH 2.5V,3.3V | |
Family | 5PB11 | |
Input Conditioning | STANDARD | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e3 | |
Length | 4.4 mm | |
Logic IC Type | LOW SKEW CLOCK DRIVER | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Inverted Outputs | ||
Number of Terminals | 8 | |
Number of True Outputs | 4 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Propagation Delay (tpd) | 2.9 ns | |
Same Edge Skew-Max (tskwd) | 0.05 ns | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.465 V | |
Supply Voltage-Min (Vsup) | 1.71 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3 mm |
Alternate Parts for 5PB1104PGGI
This table gives cross-reference parts and alternative options found for 5PB1104PGGI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5PB1104PGGI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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5PB1104PGGK8 | Integrated Device Technology Inc | Check for Price | TSSOP-8, Reel | 5PB1104PGGI vs 5PB1104PGGK8 |
5PB1104PGGI Frequently Asked Questions (FAQ)
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A good PCB layout for the 5PB1104PGGI involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
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To ensure proper powering and decoupling of the 5PB1104PGGI, use a high-quality power supply with low ripple and noise, and add decoupling capacitors (e.g., 0.1uF and 10uF) close to the device. Also, ensure that the power and ground pins are connected to a solid power plane and ground plane, respectively.
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The 5PB1104PGGI has a maximum junction temperature of 150°C. To ensure reliable operation, keep the device within the recommended operating temperature range (–40°C to 85°C) and provide adequate heat dissipation through a heat sink or thermal pad, especially in high-power applications.
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To troubleshoot issues with the 5PB1104PGGI, start by verifying the power supply and decoupling, then check the input and output signals using an oscilloscope. Ensure that the device is properly soldered and that there are no shorts or opens on the PCB. Consult the datasheet and application notes for specific troubleshooting guidelines.
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To minimize EMI and RFI issues with the 5PB1104PGGI, use a shielded enclosure, keep the device away from antennas and other EMI sources, and ensure that the PCB layout is designed to minimize radiation. Additionally, use EMI filters or common-mode chokes on the input and output lines if necessary.