Part Details for 5M2210ZF324I5 by Intel Corporation
Results Overview of 5M2210ZF324I5 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
Energy and Power Systems
5M2210ZF324I5 Information
5M2210ZF324I5 by Intel Corporation is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 5M2210ZF324I5
5M2210ZF324I5 CAD Models
5M2210ZF324I5 Part Data Attributes
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5M2210ZF324I5
Intel Corporation
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Datasheet
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5M2210ZF324I5
Intel Corporation
Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, FBGA-324
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 19 X 19 MM, 1 MM PITCH, FBGA-324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| Additional Feature | YES | |
| Clock Frequency-Max | 201.1 MHz | |
| In-System Programmable | YES | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e0 | |
| JTAG BST | YES | |
| Length | 19 mm | |
| Number of Dedicated Inputs | ||
| Number of I/O Lines | 271 | |
| Number of Inputs | 271 | |
| Number of Macro Cells | 1700 | |
| Number of Outputs | 271 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 271 I/O | |
| Output Function | MACROCELL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA324,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Programmable Logic Type | FLASH PLD | |
| Propagation Delay | 11.2 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm |
Alternate Parts for 5M2210ZF324I5
This table gives cross-reference parts and alternative options found for 5M2210ZF324I5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5M2210ZF324I5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 5M2210ZF324I5N | Intel Corporation | Check for Price | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 | 5M2210ZF324I5 vs 5M2210ZF324I5N |
| 5M2210ZF324C5N | Altera Corporation | Check for Price | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 | 5M2210ZF324I5 vs 5M2210ZF324C5N |
| 5M2210ZF324C5 | Intel Corporation | Check for Price | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, FBGA-324 | 5M2210ZF324I5 vs 5M2210ZF324C5 |
| 5M2210ZF324C5N | Intel Corporation | Check for Price | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 | 5M2210ZF324I5 vs 5M2210ZF324C5N |
| 5M2210ZF324C5 | Altera Corporation | Check for Price | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, FBGA-324 | 5M2210ZF324I5 vs 5M2210ZF324C5 |
5M2210ZF324I5 Frequently Asked Questions (FAQ)
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Intel provides a PCB design guide for the 5M2210ZF324I5, which recommends a 4-6 layer stackup with a minimum of 2 mil trace width and 2 mil spacing. Additionally, Intel suggests using a high-speed PCB material with a dielectric constant of 3.5-4.5.
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Intel recommends using a multi-rail power supply with separate voltage regulators for the core, I/O, and auxiliary power rails. The power supply should be able to provide a minimum of 1A per rail, with a maximum voltage droop of 5% during power-on and power-off transitions.
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The 5M2210ZF324I5 has a maximum junction temperature of 100°C. Intel recommends using a heat sink with a thermal resistance of 10°C/W or lower, and ensuring a minimum airflow of 200 LFM to maintain a case temperature below 80°C.
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Intel recommends using a reliable configuration interface, such as JTAG or PCIe, and ensuring that the configuration data is error-free and correctly formatted. Additionally, Intel suggests using a configuration clock frequency of 50 MHz or lower to minimize errors.
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Intel recommends following the IEC 61967-1 standard for EMI and EMC compliance. This includes using a shielded enclosure, minimizing loop areas, and using EMI filters on I/O signals. Additionally, Intel suggests performing EMI and EMC testing to ensure compliance with relevant standards.