Part Details for 5CEFA7F27C8N by Intel Corporation
Results Overview of 5CEFA7F27C8N by Intel Corporation
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5CEFA7F27C8N Information
5CEFA7F27C8N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 5CEFA7F27C8N
5CEFA7F27C8N CAD Models
5CEFA7F27C8N Part Data Attributes
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5CEFA7F27C8N
Intel Corporation
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Datasheet
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5CEFA7F27C8N
Intel Corporation
Field Programmable Gate Array, 149500-Cell, CMOS, PBGA672, ROHS COMPLIANT, FBGA-672
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B672 | |
| Length | 27 mm | |
| Number of Inputs | 336 | |
| Number of Logic Cells | 149500 | |
| Number of Outputs | 336 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 5648 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 27 mm |
5CEFA7F27C8N Frequently Asked Questions (FAQ)
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Intel provides a PCB design guide and thermal management guidelines in separate documents, which can be found on their website. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
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To minimize power consumption, use the Intel Quartus Prime software to optimize the design for power, enable dynamic voltage and frequency scaling, and consider using the FPGA's built-in power management features. Additionally, implement clock gating, reduce switching activity, and use low-power modes when possible.
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Use Intel's FPGA security features, such as the Secure Device Manager, to encrypt and authenticate the configuration data. Implement access controls, secure boot mechanisms, and consider using a secure key storage solution. Additionally, follow Intel's guidelines for secure FPGA design and implementation.
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Follow Intel's signal integrity guidelines, use controlled impedance routing, and implement EMI mitigation techniques such as shielding, grounding, and filtering. Additionally, use the Intel Quartus Prime software to analyze and optimize signal integrity.
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Develop a comprehensive testing strategy that includes simulation, emulation, and physical prototyping. Use Intel's testing and validation guidelines, and consider using third-party testing tools and services to ensure the FPGA's functionality and reliability.