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Part Details for 5CEFA4F23I7N by Intel Corporation
Results Overview of 5CEFA4F23I7N by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Telecommunications
5CEFA4F23I7N Information
5CEFA4F23I7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 5CEFA4F23I7N
5CEFA4F23I7N CAD Models
5CEFA4F23I7N Part Data Attributes
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5CEFA4F23I7N
Intel Corporation
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Datasheet
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5CEFA4F23I7N
Intel Corporation
Field Programmable Gate Array, 48000-Cell, CMOS, PBGA484, ROHS COMPLIANT, FBGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B484 | |
| Length | 23 mm | |
| Number of Inputs | 304 | |
| Number of Logic Cells | 48000 | |
| Number of Outputs | 304 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1848 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 23 mm |
5CEFA4F23I7N Frequently Asked Questions (FAQ)
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The maximum operating temperature of the 5CEFA4F23I7N is typically specified in the datasheet, but if not, it's usually around 85°C for commercial-grade parts.
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The power sequencing requirements for the 5CEFA4F23I7N should be specified in the datasheet. If not, it's recommended to follow the recommended power-up and power-down sequences to prevent damage to the device.
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The recommended PCB layout for the 5CEFA4F23I7N should be specified in the datasheet or in a separate application note. If not, it's recommended to follow general PCB design guidelines for high-speed digital circuits.
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To troubleshoot issues with the 5CEFA4F23I7N, start by reviewing the datasheet and application notes, then check the power supply, clock signals, and data lines for any issues. Use oscilloscopes and logic analyzers to debug the signals.
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The thermal management considerations for the 5CEFA4F23I7N should be specified in the datasheet. If not, it's recommended to follow general guidelines for thermal management of high-power devices, including heat sinks, thermal interfaces, and airflow management.