Datasheets
341MPLF by:

SOIC-8, Tube

Part Details for 341MPLF by Integrated Device Technology Inc

Results Overview of 341MPLF by Integrated Device Technology Inc

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341MPLF Information

341MPLF by Integrated Device Technology Inc is a Clock Generator.
Clock Generators are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for 341MPLF

Part # Distributor Description Stock Price Buy
Flip Electronics Stock, ship today 9584
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Part Details for 341MPLF

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341MPLF Part Data Attributes

341MPLF Integrated Device Technology Inc
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341MPLF Integrated Device Technology Inc SOIC-8, Tube
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code SOIC
Package Description SOIC-8
Pin Count 8
Manufacturer Package Code DCG8
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-G8
JESD-609 Code e3
Length 4.9 mm
Moisture Sensitivity Level 1
Number of Terminals 8
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output Clock Frequency-Max 200 MHz
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Primary Clock/Crystal Frequency-Nom 50 MHz
Qualification Status Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max 3.45 V
Supply Voltage-Min 3.15 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm
uPs/uCs/Peripheral ICs Type CLOCK GENERATOR, OTHER

Alternate Parts for 341MPLF

This table gives cross-reference parts and alternative options found for 341MPLF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 341MPLF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
341MIPLF Integrated Device Technology Inc Check for Price SOIC-8, Tube 341MPLF vs 341MIPLF
341MIPLFT Integrated Device Technology Inc Check for Price SOIC-8, Reel 341MPLF vs 341MIPLFT
341MPT Integrated Device Technology Inc Check for Price Clock Generator, 200MHz, CMOS, PDSO8, 0.150 INCH, SOIC-8 341MPLF vs 341MPT

341MPLF Related Parts

341MPLF Frequently Asked Questions (FAQ)

  • IDT recommends a 4-layer PCB with a solid ground plane, and a separate power plane for the VCC and VEE supplies. Additionally, keep the signal traces short and away from the power planes to minimize noise and coupling.

  • Follow the power-up sequence specified in the datasheet, and ensure that the VCC and VEE supplies are stable and within the recommended voltage range. Also, initialize the device by setting the appropriate register values and configuring the clock inputs.

  • The 341MPLF has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Also, follow IDT's recommended thermal design guidelines for optimal thermal performance.

  • Use IDT's recommended debugging tools, such as a logic analyzer or oscilloscope, to capture and analyze the device's signals. Also, consult the datasheet and application notes for troubleshooting guidelines and common error scenarios.

  • Yes, the 341MPLF is a high-frequency device and requires proper EMI/EMC design considerations. Follow IDT's recommended EMI/EMC design guidelines, and ensure that the PCB layout and component selection minimize electromagnetic radiation and susceptibility.

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