Part Details for 2SAR573DFHGTL by ROHM Semiconductor
Results Overview of 2SAR573DFHGTL by ROHM Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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2SAR573DFHGTL Information
2SAR573DFHGTL by ROHM Semiconductor is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for 2SAR573DFHGTL
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2SAR573DFHGTL
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Avnet Silica | (Alt: 2SAR573DFHGTL) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 9 Weeks, 0 Days | Silica - 0 |
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Part Details for 2SAR573DFHGTL
2SAR573DFHGTL CAD Models
2SAR573DFHGTL Part Data Attributes
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2SAR573DFHGTL
ROHM Semiconductor
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Datasheet
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2SAR573DFHGTL
ROHM Semiconductor
Power Bipolar Transistor, 3A I(C), 50V V(BR)CEO, 1-Element, PNP, Silicon, TO-252, Plastic/Epoxy, 2 Pin, SC-63, 3/2 PIN
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | ROHM CO LTD | |
| Package Description | SC-63, 3/2 PIN | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | ROHM Semiconductor | |
| Case Connection | COLLECTOR | |
| Collector Current-Max (IC) | 3 A | |
| Collector-Emitter Voltage-Max | 50 V | |
| Configuration | SINGLE | |
| DC Current Gain-Min (hFE) | 180 | |
| JEDEC-95 Code | TO-252 | |
| JESD-30 Code | R-PSSO-G2 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | PNP | |
| Reference Standard | AEC-Q101 | |
| Surface Mount | YES | |
| Terminal Form | GULL WING | |
| Terminal Position | SINGLE | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | AMPLIFIER | |
| Transistor Element Material | SILICON | |
| Transition Frequency-Nom (fT) | 300 MHz |
2SAR573DFHGTL Frequently Asked Questions (FAQ)
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ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including derating the voltage and current according to the temperature. Additionally, consider using a heat sink or thermal management system to keep the junction temperature below 150°C.
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ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s. It's essential to follow the recommended soldering profile to prevent damage to the component.
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Yes, the 2SAR573DFHGTL is qualified for automotive and high-reliability applications. ROHM provides a dedicated automotive grade version, which meets the AEC-Q101 standard. However, it's essential to consult with ROHM's technical support team to ensure the component meets the specific requirements of your application.
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The 2SAR573DFHGTL is a moisture-sensitive device (MSD). To prevent damage, it's essential to store the component in a dry environment, and follow the recommended handling and storage procedures. If the component is exposed to moisture, it's crucial to bake it according to ROHM's recommended baking procedure before soldering.