Part Details for 24AA256T-I/MSRVE by Microchip Technology Inc
Results Overview of 24AA256T-I/MSRVE by Microchip Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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24AA256T-I/MSRVE Information
24AA256T-I/MSRVE by Microchip Technology Inc is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for 24AA256T-I/MSRVE
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
24AA256T-I/MSRVE
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Microchip Technology Inc | 256K, 32K X 8 1.8V SERIAL EE, MSOP, Projected EOL: 2025-10-18 - Contact for Pricing ECCN: EAR99 RoHS: Compliant Container: Reel |
0 Alternates Available |
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RFQ |
Part Details for 24AA256T-I/MSRVE
24AA256T-I/MSRVE CAD Models
24AA256T-I/MSRVE Part Data Attributes
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24AA256T-I/MSRVE
Microchip Technology Inc
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Datasheet
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24AA256T-I/MSRVE
Microchip Technology Inc
EEPROM, 32KX8, Serial, CMOS, PDSO8
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | MSOP-8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Factory Lead Time | 28 Weeks | |
| Clock Frequency-Max (fCLK) | 0.4 MHz | |
| Data Retention Time-Min | 200 | |
| Endurance | 1000000 Write/Erase Cycles | |
| I2C Control Byte | 1010DDDR | |
| JESD-30 Code | S-PDSO-G8 | |
| Length | 3 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP8,.19 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | SERIAL | |
| Reverse Pinout | NO | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.1 mm | |
| Serial Bus Type | I2C | |
| Standby Current-Max | 0.000005 A | |
| Supply Current-Max | 0.003 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Width | 3 mm | |
| Write Cycle Time-Max (tWC) | 5 ms | |
| Write Protection | HARDWARE |