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Part Details for 10M40DAF672I7G by Intel Corporation
Results Overview of 10M40DAF672I7G by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
10M40DAF672I7G Information
10M40DAF672I7G by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 10M40DAF672I7G
| Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | IC FPGA 500 I/O 672FBGA | 74 |
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$2,895.7500 | Buy Now |
Part Details for 10M40DAF672I7G
10M40DAF672I7G CAD Models
10M40DAF672I7G Part Data Attributes
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10M40DAF672I7G
Intel Corporation
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Datasheet
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10M40DAF672I7G
Intel Corporation
Field Programmable Gate Array, 40000-Cell, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-672
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-672 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B672 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 2500 | |
| Number of Inputs | 500 | |
| Number of Logic Cells | 40000 | |
| Number of Outputs | 500 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2500 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 27 mm |
10M40DAF672I7G Frequently Asked Questions (FAQ)
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The maximum junction temperature for the 10M40DAF672I7G is 100°C, as specified in the datasheet. However, it's recommended to operate the device at a lower temperature to ensure reliability and longevity.
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A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal when the voltage is below a certain threshold. The FPGA's POR signal can be connected to the voltage supervisor's output.
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The recommended PCB layout and stack-up for the 10M40DAF672I7G involves using a 4-6 layer PCB with a stack-up of signal-ground-signal-power-ground-signal. This helps to minimize noise and ensure signal integrity. Additionally, it's recommended to use a solid ground plane and to route critical signals on inner layers.
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To optimize timing closure, it's essential to follow a structured design methodology, including floorplanning, pipelining, and register balancing. Additionally, using Intel's Quartus II software can help to optimize timing closure by providing features such as automatic placement and routing, and timing-driven compilation.
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The recommended decoupling capacitors for the 10M40DAF672I7G are 0.1uF and 1uF ceramic capacitors, placed as close as possible to the FPGA's power pins. These capacitors help to filter out noise and ensure stable power supply voltage.