Part Details for 10M25DAF256I6G by Intel Corporation
Results Overview of 10M25DAF256I6G by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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10M25DAF256I6G Information
10M25DAF256I6G by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 10M25DAF256I6G
10M25DAF256I6G CAD Models
10M25DAF256I6G Part Data Attributes
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10M25DAF256I6G
Intel Corporation
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Datasheet
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10M25DAF256I6G
Intel Corporation
Field Programmable Gate Array, PBGA256, 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Number of CLBs | 1563 | |
| Number of Inputs | 360 | |
| Number of Logic Cells | 25000 | |
| Number of Outputs | 360 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1563 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.25 V | |
| Supply Voltage-Min | 1.15 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 17 mm |
Alternate Parts for 10M25DAF256I6G
This table gives cross-reference parts and alternative options found for 10M25DAF256I6G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 10M25DAF256I6G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| 10M25DAF256I6 | Intel Corporation | Check for Price | Field Programmable Gate Array, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 | 10M25DAF256I6G vs 10M25DAF256I6 |
10M25DAF256I6G Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the 10M25DAF256I6G is -40°C to 100°C.
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To implement a CDC in the 10M25DAF256I6G, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated.
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The maximum frequency achievable with the 10M25DAF256I6G depends on the specific design and implementation, but Intel's Quartus II software can help estimate the maximum frequency.
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To optimize power consumption, use Intel's PowerPlay power analysis tool, reduce clock frequencies, and implement power-gating and dynamic voltage and frequency scaling (DVFS) techniques.
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Yes, the 10M25DAF256I6G is suitable for high-reliability applications, such as aerospace and defense, due to its radiation-hardened design and error correction capabilities.