Part Details for 10AX115H2F34E2SG by Intel Corporation
Results Overview of 10AX115H2F34E2SG by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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10AX115H2F34E2SG Information
10AX115H2F34E2SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 10AX115H2F34E2SG
10AX115H2F34E2SG CAD Models
10AX115H2F34E2SG Part Data Attributes
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10AX115H2F34E2SG
Intel Corporation
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Datasheet
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10AX115H2F34E2SG
Intel Corporation
Field Programmable Gate Array, 1150000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| JESD-30 Code | S-PBGA-B1152 | |
| Length | 35 mm | |
| Number of CLBs | 42720 | |
| Number of Inputs | 504 | |
| Number of Logic Cells | 1150000 | |
| Number of Outputs | 504 | |
| Number of Terminals | 1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 42720 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.5 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 35 mm |
Alternate Parts for 10AX115H2F34E2SG
This table gives cross-reference parts and alternative options found for 10AX115H2F34E2SG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 10AX115H2F34E2SG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| 10AX115H2F34E2SG | Altera Corporation | Check for Price | Field Programmable Gate Array, 1150000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | 10AX115H2F34E2SG vs 10AX115H2F34E2SG |
10AX115H2F34E2SG Frequently Asked Questions (FAQ)
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Intel provides a PCB design guide for the Arria 10 FPGA family, which includes the 10AX115H2F34E2SG. The guide recommends a 4-6 layer PCB stackup with a minimum of two power planes and two ground planes. It also provides guidelines for signal routing, decoupling, and thermal management.
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Intel provides a PowerPlay Early Power Estimator (EPE) tool that allows you to estimate power consumption based on your design's specific requirements. You can also use the Quartus II software to optimize power consumption by selecting the optimal voltage, frequency, and power-saving features for your design.
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The 10AX115H2F34E2SG has a maximum junction temperature of 100°C. Intel recommends using a heat sink with a thermal interface material (TIM) to maintain a junction temperature below 85°C. The FPGA's thermal design power (TDP) is 12W, and the recommended airflow is 200-400 LFM.
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Intel recommends using a reliable configuration device, such as a flash memory device, and implementing a robust boot-up sequence that includes error detection and correction mechanisms. The Quartus II software provides tools and guidelines for configuring and booting up the FPGA.
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The 10AX115H2F34E2SG is designed to meet the radiation and EMC requirements for commercial and industrial applications. However, for specific applications that require additional radiation hardness or EMC compliance, Intel recommends consulting the FPGA's radiation report and EMC guidelines.