Part Details for 10AX090U4F45E3SG by Intel Corporation
Results Overview of 10AX090U4F45E3SG by Intel Corporation
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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10AX090U4F45E3SG Information
10AX090U4F45E3SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 10AX090U4F45E3SG
10AX090U4F45E3SG CAD Models
10AX090U4F45E3SG Part Data Attributes
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10AX090U4F45E3SG
Intel Corporation
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Datasheet
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10AX090U4F45E3SG
Intel Corporation
Field Programmable Gate Array, 900000-Cell, CMOS, PBGA1932, 45 X 45 MM, ROHS COMPLIANT, FBGA-1932
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1932 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B1932 | |
| Length | 45 mm | |
| Number of CLBs | 33962 | |
| Number of Inputs | 480 | |
| Number of Logic Cells | 900000 | |
| Number of Outputs | 480 | |
| Number of Terminals | 1932 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 33962 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.5 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | TSMC | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 45 mm |
10AX090U4F45E3SG Frequently Asked Questions (FAQ)
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Intel provides a PCB design guide for the 10AX090U4F45E3SG FPGA, which includes recommendations for PCB layout, stackup, and signal routing to ensure optimal signal integrity. The guide can be found on Intel's website.
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Intel provides a power management guide for the 10AX090U4F45E3SG FPGA, which includes recommendations for power supply design, voltage regulation, and thermal management. Additionally, Intel's PowerPlay Early Power Estimator (EPE) tool can be used to estimate power consumption and optimize power management.
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Intel provides a clocking and PLL user guide for the 10AX090U4F45E3SG FPGA, which includes recommendations for clocking architecture, PLL configuration, and clock domain crossing. The guide can be found on Intel's website.
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Intel provides a configuration and boot user guide for the 10AX090U4F45E3SG FPGA, which includes recommendations for configuration modes, boot mechanisms, and error detection and correction. The guide can be found on Intel's website.
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Intel provides a high-speed transceiver user guide for the 10AX090U4F45E3SG FPGA, which includes recommendations for transceiver configuration, signal integrity, and channel bonding. The guide can be found on Intel's website.